MachXO4

​​Next Generation of Low-Power & Non-Volatile Control FPGAs​

The MachXO4™ family extends Lattice Semiconductor’s ultra-low-density FPGA portfolio with advanced features designed for flexibility and efficiency. These devices combine low power consumption, embedded flash, high I/O density, and instant-on capability to meet the demands of modern systems.

Offering exceptional I/O density in compact packages, MachXO4™ integrates hardened functions that help reduce overall system cost and footprint. With broad programmability and native support for industry-standard interfaces, this device family provides a scalable platform for evolving connectivity and control applications.

Built on a 65 nm non-volatile low-power process, MachXO4™ comes in two variants: high performance with 2.5V/3.3V supply (HC) and high performance with 1.2V supply (HE). Both are functionally and pin-compatible.

Features

  • Efficient Design with the Latest Generation of Tools and Silicon
    Wide range of logic density from 896 to 9400 LUTs, fabric performance of up to 150 MHz, and enhanced support in Lattice Radiant software for improved design productivity
  • Highly Flexible and Robust I/O
    Supports 3.3V - 1.0V I/O standards, hot socketing with low leakage current of 350 uA, mixed voltage support for LVCMOS and LVTTL, and default pulldown resistors to minimize external components
  • Best-in-Class Power Efficiency in Smallest Form Factor
    Low power consumption as low as 1 mW of static power and compact packages as small as 2.5 mm x 2.5 mm

Technical Features & Advantages

  • Embedded flash memory with User Flash Memory (UFM) up to 448 kb
  • Instant-on power-up with fast boot time of less than 5 ms
  • Hot socketing with leakage current as low as 350 uA and no power supply sequencing
  • Compact packages with high I/O-to-LUT ratio up to 382 I/O pins
  • On-chip hardened functions: SPI, I2C, timer/counter, and oscillator
  • Available in Commercial, Industrial, and Automotive grades

Jump to

Family Table

MachXO4 Device Selection Guide
Features LFMXO4-010 LFMXO4-015 LFMXO4-025 LFMXO4-050 LFMXO4-080 LFMXO4-110
Look-up Table (LUT) 896 1,280 2,112 4,320 6,864 9,400
Logic Cells 1,100 1,600 2,600 5,200 8,300 11,300
Embedded RAM (M9k Blocks / kb) 7 / 64 7 / 64 8 / 74 10 / 92 26 / 240 48 / 432
Distributed RAM (kb) 10 10 16 34 54 73
User Flash Memory (kb) 64 64 80 96 256 448
Dual Boot External External External External External External
Phased Lock Loop (PLL) 1 1 1 2 2 2
I2C 2 2 2 2 2 2
SPI 1 1 1 1 1 1
Timer/Counter 1 1 1 1 1 1
On-chip Oscillator 1 1 1 1 1 1
VCC = 2.5 V / 3.3 V Yes Yes Yes Yes Yes Yes
VCC = 1.2 V Yes Yes Yes Yes Yes Yes
Temperature Grade C / I / A C / I / A C / I / A C / I / A C / I C / I
0.4 mm Pitch Packages Total I/O Count
  LFMXO4-010 LFMXO4-015 LFMXO4-025 LFMXO4-050 LFMXO4-080 LFMXO4-110
UUG3611 (36-ball WLCSP, 2.5 x 2.5 mm)
27



UUG4911 (49-ball WLCSP, 3.2 x 3.2 mm)

37


UUG8111 (81-ball WLCSP, 3.8 x 3.8 mm)


62

0.5 mm Pitch Packages Total I/O Count
  LFMXO4-010 LFMXO4-015 LFMXO4-025 LFMXO4-050 LFMXO4-080 LFMXO4-110
TSG100 (100-pin TQFP, 14 x 14 mm) 78 2 78 2 78 2


BSG132 (132-ball csBGA, 8 x 8 mm) 102 2 102 2 102 2 102 2

TSG144 (144-pin TQFP, 20 x 20 mm) 105 105 109 112

0.8 mm Pitch Packages Total I/O Count
  LFMXO4-010 LFMXO4-015 LFMXO4-025 LFMXO4-050 LFMXO4-080 LFMXO4-110
BBG256 (256-ball caBGA, 14 x 14 mm)
204 2 204 2 204 2 204 2 204 2
BBG400 (400-ball caBGA, 17 x 17 mm)


333 333 333
BBG484 (484-ball caBGA, 19 x 19 mm)




382
1.0 mm Pitch Packages Total I/O Count
  LFMXO4-010 LFMXO4-015 LFMXO4-025 LFMXO4-050 LFMXO4-080 LFMXO4-110
BFG256 (256-ball ftBGA, 17 x 17 mm)
204 204 204

1. Package is only available for VCC = 1.2 V devices.
2. Package is available for automotive devices.

Example Use Cases

System Board Management

  • High I/O count for sensor and actuator interfacing
  • Instant-on (<5 ms) for real-time control
  • Compact form factor for board-level integration
  • Integrated flash for configuration without external memory
  • Single voltage rail simplifies power design

Motor Control

  • Support for various motor types across industrial, automotive, and embedded systems
  • IGBT protection and SPI for real-time MCU feedback
  • Low-power, fast-response communication standard compatibility
  • Small footprint

Camera & Display Bridging

  • Supports 1–4 CSI-2 lanes up to 900 Mbps (Rx/Tx)
  • DSI Tx with HS and LP modes (Tx/Rx)
  • Compatible with RAW, YUV, RGB, YCbCr, and user-defined formats
  • Compact package: Fits in 36-WLCSP (2.5 × 2.5 mm)

LED Control

  • Programmable I/O and PLL for dimming, blinking, and color mixing
  • Low power operation for efficient lighting
  • Integrated Flash/UFM for storing LED profiles

Design Resources

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Intellectual Property & Reference Designs

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