Lattice Blog

At Linley Fall Processor Conference, Lattice shared latest updates to Lattice sensAI™, a solution stack for next-generation smart devices with extremely low power consumption.

Read the latest consumer news from Lattice: Enhanced sensAI Stack Enables More Accurate, Lower Power Edge Solutions, Free Webinar Explores Low Power AI Design, CrossLink FPGAs Simplify Use of Embedded Vision

CrossLinkPlus devices are low power FPGAs featuring integrated flash memory, a hardened MIPI D-PHY and high-speed I/Os for instant-on and flexible on-device programming capabilities, while bringing ready-to-use IPs to accelerate video bridging application development.

Read the latest industrial and automotive news from Lattice: Enhanced sensAI stack packs 10X performance boost, Integrate AI into smart applications, CrossLink FPGA simplifies use of embedded vision, Lattice showcases sensAI at Microsoft Hackathon.

Lattice Semiconductor sponsored the Microsoft Sensors Hack, part of the larger 2019 Hackathon event, where Microsoft teams used the Lattice sensAI solutions stack for smart vision systems to create potential use cases for AI and sensors.

Read the latest comms and computing news from Lattice: Low power wireless Heterogenous Networks development and upgrade security with Lattice’s MachXO3D FPGA.

If you’re looking at ways to implement Edge AI, be sure to read about the use cases for the Lattice sensAI solution stack for always-on Edge devices covered at the end of our white paper.

Read the latest consumer news from Lattice: Lattice sensAI brings more performance to the edge, Radiant IP and reference design, demo videos from Embedded Vision Summit, industry award and press coverage for sensAI

If you missed the 2019 Embedded Vision Summit, check out the latest sensAI demos from Lattice to and see what smart vision can enable in Edge devices

Read the latest automotive and industrial news from Lattice: New MachXO3D FPGA brings secures entire systems with hardware root-of-trust, Crosslink bridge connects industrial displays to mobile processors, new 3D Depth Mapping demo, new Scaler IP core for ECP5, and a new version of Diamond Software v 3.11 adds support for MachXO3D.