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ID: 3813
实例类型: faq
分类: Customer Board Design
相关: Layout
产品系列: All FPGA

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What is the differencebetween solder ball diameter and solder ball land diameter in TN1074, PCB Layout Recommendations for BGA Packages?

Solder ball
diameter refers to component/package ball diameter, and solder ball land
diameter refers to PCB land diameter.

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