All Devices: How much weight can the Lattice lead free BGA package tolerate (for heat sink mounting)?SupportArticlePage3297515a-8996-437e-89a0-ef96701c2888FAQ/Support/AnswerDatabase/1/8/0/1807https://edge.sitecorecloud.io/latticesemi9e32-latticesemi06bb-prod9ecc-d341/media/Project/Lattice/LatticeSemi/Images/SearchThumbnails/FAQ.png?sc_lang=enAssuming the pressure on the package is uniform and evenly distributed over the entire topside surface, the loading will be on the BGA ball. Each lead free ball can withstand ~3N of force (roughly .3 kg) before permanent deformation. Assuming a 484 pin package, the weight can be calculate as below: .3 * 484 = 145.2 Kg Generally, it should not exceed 10% of this value or 14.2 Kg. This is more than sufficient to mount the heat sink.
