Power Manager II: What is the Peak Reflow Temperature for the ProcessorPM or POWR605?
Please refer to FPGA-TN-02041 - Solder Reflow Guide for Surface Mount Devices for more details.
The ProcessorPM and POWR605 are the same device with QFNS 24 package type. User may refer to Table 8.2. Peak Reflow Temperature (TP) by Package Type and Size which stated Peak Reflow Temperature of 260 \u00B0C for the QFN24 package.