The DC-SCM 2.0 LTPI Reference Design provides multiple solution templates that uses the current LVDS Tunneling Protocol Interface (LTPI) IP that is compliant with Datacenter-ready Secure Control Module (DC-SCM) 2.0 LTPI specifications with a standardized Datacenter-ready Secure Control Interface (DC-SCI), aggregating multiple data channels such as I2C, GPIO, and UART to add more flexibility to a customer’s system and board design.
DC-SCM is a sub-project of the OCP Hardware Management Project. DC-SCM implements modular server management that contains all the FW states previously housed on a typical processor motherboard. DC-SCM moves three key elements to a common form factor module which are Management (Typical BMC functions plus LTPI), Security, and Control.
One of the significant changes in the DC-SCM 2.0 specification is the introduction of Low-voltage differential signaling Tunneling Protocol & Interface (LTPI). The LTPI addresses shortcomings of the Serial GPIO interface used in DC-SCM 1.0.
Multiple interfaces tunneling - LTPI interface is designed for tunneling various low-speed signals between the HPM and SCM. It allows for tunneling of not only GPIOs but also low-speed serial interfaces such as SMBus, I2C, UART. It is also extensible with additional proprietary OEM interfaces and provides support for raw Data tunneling between HPM CPLD and SCM CPLD.
High bandwidth capabilities - The LVDS interface provides higher bandwidth up to 800 Mbps LVDS data rate and better scalability than the SGPIO interface introduced in DC-SCM 1.0.