Please refer to the FPGA-TN-02041 (Solder Reflow Guide for Surface Mount Devices) for the Solder reflow and rework process for Lattice surface mount products. The downloadable link of the document can be found here:
https://www.latticesemi.com/view_document?document_id=8902This document also provides
Section 4. Cleaning Recommendations and
Section 5. Rework Recommendations for the PCBs. Moisture Sensitivity Level (MSL), to avoid warping of PCBs, can be found in "
Table 8.2. Peak Reflow Temperature (TP) by Package Type and Size" of the above document.