TI Wireless Solutions using Lattice FPGAs

Texas Instrument's Appleton DSP, TMS320TCI6614 is targeted for small cell base stations. Using Lattice's ECP3 with DDC/DUC functionality allows Appleton to bridge from CPRI to various transceivers. TI's 3rd party Azcom Technology has built the following baseband board that can support LTE and WCMDA up to a 4x4 antenna configuration.

To see more details go to www.azcom.it/index.php

We have also completed a SRIO (Serial Rapid I/O) demo with TI. This demo utilizes the SRIO v2.1 IP in an ECP3. The demonstration can support up to 4 lanes x 3.125Gbps.

Texas Instrument's wideband digital transmit and receive processor, the GC5330 is designed for remote radio head applications. The GC5330 has a LVDS baseband interface that is intended to connect to a baseband processor. This LVDS interface typically is bridged to CPRI. The TI GC5330 EVM uses the LatticeECP3 to interface to the LVDS baseband interface and there is also an SFP connector on the board that can link to CPRI. For further details on this solution please contact your local Lattice sales representative.