Lattice Press Release

Lattice Semiconductor and Leopard Imaging Deliver USB 3.0 Camera for Industrial Applications

New Camera Modules Feature Lattice MachXO3™ FPGA and Sensor Bridge Reference Design

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  • MachXO3™ FPGA and a USB 3.0 sensor bridge reference design integrated in a new USB 3.0 camera module for industrial applications
  • MachXO3 FPGAs can deliver I/O speeds of up to 900 Mbps to convert high-quality video images into any desired format, without compromising overall video system performance

Portland, OR – October 26, 2015 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, today announced that its MachXO3 FPGA and USB 3.0 sensor bridge reference design are integrated in a new USB 3.0 camera module from Leopard Imaging, a leader in high-definition embedded cameras.

The MachXO3 FPGA and the USB 3.0 sensor bridge reference design work together to convert the subLVDS video signal from the image sensor used in the module to a parallel format that can interface with the camera’s USB 3.0 controller. The ability to convert the video signal to a format compatible with the USB controller allows the embedded camera module to be used in a wide variety of industrial systems.

“With the multitude of video standards being used in embedded applications, it’s vital that we are able to convert those signals into whatever formats a particular industrial system requires,” said Bill Pu, President, Leopard Imaging. “Lattice Semiconductor’s MachXO3 FPGA provided the programmability and bridging functionality in the small form factor our USB 3.0 camera module requires, and their sensor bridge reference design accelerated our ability to incorporate the Lattice technology into our final product.”

“Camera image sensor interfacing is an increasingly popular feature in embedded applications,” said Deepak Boppana, director of product marketing at Lattice Semiconductor. “Our MachXO3 FPGAs can deliver I/O speeds of up to 900 Mbps, so our customers can convert even high-quality video images into any desired format, without compromising overall video system performance.”

Reference designs are available for subLVDS, MIPI® CSI-2, HiSPi and USB3 FX3 controller interfacing and bridging and can be customized to match the applications. More information about the MachXO3 family of FPGAs and the USB 3.0 sensor bridge reference design are available at

The USB 3.0 camera modules can be purchased directly from Leopard Imaging.

About Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the global leader in smart connectivity solutions, providing market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The Company’s broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.

Lattice was founded in 1983 and is headquartered in Portland, Oregon. In March 2015, the Company acquired Silicon Image, which is a leader in setting industry standards including the highly successful HDMI®, DVI™, MHL® and WirelessHD® standards.

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Lattice Semiconductor Corporation, Lattice Semiconductor (& design), L (& design), DVI, HDMI, MHL, WirelessHD, MachXO3, and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

MIPI is a registered trademark owned by the MIPI Alliance.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.

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