"Lattice Semiconductor is committed to conducting business in a manner consistent with the efficient use of resources and materials, and the preservation of the natural environment."
Due to increased worldwide environmental concerns, the need for lead free and haolgen free solutions in electronic components and systems is receiving increasing attention within the semiconductor and electronics industries. Lattice is fully supportive of the various industry efforts throughout the world to phase out the use of lead and other undesirable elements from electronic equipment materials and manufacturing processes.
Lattice remains committed to continually reducing its impact on the world's natural environment and works closely with our customers and suppliers to identify and rapidly eliminate hazardous substances from its products.
Environmental protection is more than just meeting standards. All corporate activities must be implemented with the environment in mind. Lattice's goal is to develop all new products such that they reduce space, materials and power consumption for an equivalent electrical function. In turn, this allows our customers to continually reduce their impact on the environment.
ISO14001 is an international standard for environmental management systems. Companies that are ISO14001 registered have demonstrated an internal program for the management of hazardous waste and implementation of recycling programs. This international recognition certifies a company's commitment to preserving the natural environment. All Lattice subcontract manufacturers are ISO14001 registered, and are routinely reviewed to ensure continued compliance.
Lattice Semiconductor is a leader in the development of green packaging solutions. Lattice currently offers an extensive list of standard products in lead free and halogen free packaging.
Lattice's lead free and halogen free products are fully RoHS compliant, meeting the European Parliament Directive entitled "Restrictions on the use Of Hazardous Substances" (RoHS). This Directive prohibits the use of the following elements in electrical/electronic equipment sold after 7/1/2006: cadmium (Cd), lead (Pb), mercury (Hg), hexavalent chromium (Cr(VI)), polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs). Lattice's lead free and halogen free products are compliant with this Directive today, well ahead of the July, 2006 deadline.
Lattice has qualified a wide variety of package types in lead free and halogen free configurations. These qualified packages include the Plastic Leaded Chip Carrier (PLCC), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Fine Pitch BGA (fpBGA), Fine Pitch Thin BGA (ftBGA), Chip Array BGA (caBGA), Chip Scale BGA (csBGA), Ultra Chip Scale BGA (ucBGA), Flip Chip BGA (fcBGA), Quad Flat-Pack No Lead Saw-Singulated (QFNS) and Wafer Level Chip Scale Packaging (WLCSP). To better facilitate the industry transition to lead-free and halogen-free PLDs, Lattice offers the following broad assortment of standard, off-the-shelf, product families in green packages.
| Product Family | Device Family | Description | Halogen-Free (RoHS6/6) | Lead-Free (RoHS6/6) | Related Literature | ||
|---|---|---|---|---|---|---|---|
| Backwards Compatible | Standard | Backwards Compatible | Standard | ||||
| MachXO2 | MachXO2 "ZE" | 1.2V Low-Power, Do-it-All PLD |
100 TQFP |
25 WLCSP 1 36 WLCSP 1 64 ucBGA 2 132 csBGA 184-ball csBGA 4 256 caBGA 256 ftBGA 332 caBGA 484 fpBGA |
Datasheet | ||
| MachXO2 "HC" | 2.5/3.3V High Performance, Do-it-All PLD | ||||||
| MachXO2 "HE" | 1.2V High Performance, Do-it-All PLD | ||||||
| LatticeXP2 | LatticeXP2 | 1.2V Low-Cost, Non-Volatile FPGA with flexiFLASH Architecture and Live Update Technology | 144 TQFP 208 PQFP |
132 csBGA 256 ftBGA 484 fpBGA 672 fpBGA |
Datasheet | ||
| LatticeSC | LatticeSC | 1.2/1.0V High Performance FPGA | 256 fpBGA 900 fpBGA 1020 fcBGA 1152 fcBGA 1704 fcBGAZ |
Datasheet | |||
| LatticeSCM | 1.2/1.0V High Performance FPGA with Maco Block | ||||||
| LatticeECP3 | LatticeECP3 | 1.2V Low-Power, High Value FPGA for High-Volume Applications | 256 ftBGA 484 fpBGA 672 fpBGA 1156 fpBGA |
Datasheet | |||
| LatticeECP2/M | LatticeECP2 | 1.2V Low-Cost FPGA, High End Feature Set for High-Volume Applications | 144 TQFP 208 PQFP |
256 fpBGA 484 fpBGA 672 fpBGA 900 fpBGA |
Datasheet | ||
| LatticeECP2M | 1.2V Low-Cost FPGA with SERDES, High End Feature Set for High-Volume Applications | 256 fpBGA 484 fpBGA 672 fpBGA 900 fpBGA 1152 fpBGA |
Datasheet | ||||
| MachXO | MachXO "C" | 1.8/2.5/3.3V Most Versatile Non-Volatile PLD | 100 TQFP 144 TQFP |
100 csBGA |
Datasheet | ||
| MachXO "E" | 1.2V Most Versatile Non-Volatile PLD | ||||||
| LA-MachXO "C" | AEC-Q100 Qualified 1.8/2.5/3.3V Most Versatile Non-Volatile PLD | 100 TQFP 144 TQFP |
256 ftBGA 324 ftBGA |
Datasheet | |||
| LA-MachXO "E" | AEC-Q100 Qualified 1.2V Most Versatile Non-Volatile PLD | ||||||
| LatticeXP | LatticeXP "C" | 1.8/2.5/3.3V Low-Cost, Non-Volatile FPGAs with TransFR Technology | 100 TQFP 144 TQFP 208 PQFP |
256 fpBGA 388 fpBGA 484 fpBGA |
Datasheet | ||
| LatticeXP "E" | 1.2V Low-Cost, Non-Volatile FPGAs with TransFR Technology | ||||||
| LatticeECP/EC | LatticeECP-DSP | 1.2V Low-Cost FPGA with High Performance Embedded DSP | 208 PQFP 100 TQFP 144 TQFP |
256 fpBGA 484 fpBGA 672 fpBGA |
Datasheet | ||
| LatticeEC | 1.2V Low-Cost FPGA for High-Volume Applications | ||||||
| ispXPGA | ispXPGA-B/EB | 3.3/2.5V Non-Volatile, Infinitely Reconfigurable FPGA | 256 fpBGA | Datasheet | |||
| ispGDX2 | ispGDX2-V/EV | 3.3V High Performance Digital Crosspoint Switch | 100 fpBGA 208 fpBGA 484 fpBGA |
Datasheet | |||
| ORCA 4 FPSC | ORT82G5/42G5 ORSO82G5/42G5 ORT8850H ORT8850L |
1.5V ORCA 4 FPGA Plus Embedded High-Performance ASIC Core | 484 fpBGA 680 fpBGA |
Datasheet Datasheet Datasheet Datasheet |
|||
| ispMACH 4000 | ispMACH 4000ZE | 1.8V Ultra-Low Power CPLD | 48 TQFP3 100 TQFP3 144 TQFP3 |
64 csBGA3 144 csBGA |
Datasheet | ||
| ispMACH 4000Z | 1.8V SuperFAST Zero-Power CPLD | 48 TQFP 100 TQFP 176 TQFP |
56 csBGA 132 csBGA |
Datasheet | |||
| ispMACH 4000V | 3.3V SuperFAST Low-Power CPLD | 44 TQFP 48 TQFP 100 TQFP 128 TQFP 144 TQFP 176 TQFP |
256 ftBGA | ||||
| ispMACH 4000B | 2.5V SuperFAST Low-Power CPLD | ||||||
| ispMACH 4000C | 1.8V SuperFAST Low-Power CPLD | ||||||
| LA-ispMACH 4000Z | AEC-Q100 Qualified 1.8V SuperFAST Zero-Power CPLD | 48 TQFP 100 TQFP |
Datasheet | ||||
| LA-ispMACH 4000V | AEC-Q100 Qualified 3.3V SuperFAST Low-Power CPLD | 44 TQFP 48 TQFP 100 TQFP 128 TQFP 144 TQFP |
Datasheet | ||||
| ispXPLD 5000MX | ispXPLD 5000MV | 3.3V High Density CPLD + Memory | 208 PQFP | 256 fpBGA 484 fpBGA 672 fpBGA |
Datasheet | ||
| ispXPLD 5000MB | 2.5V High Density CPLD + Memory | ||||||
| Platform Manager | Platform Manager | In-System Programmable Power Supply Monitoring, Sequencing and Margining Controller | 128 TQFP | 208 ftBGA | Datasheet | ||
| ispPAC-POWR | ispPAC-POWR1220AT8 | In-System Programmable Power Supply Monitoring, Sequencing and Margining Controller | 100 TQFP | Datasheet | |||
| ispPAC-POWR1014/A | In-System Programmable Power Supply Supervisor, Reset Generator and Sequencing Controller | 48 TQFP | Datasheet | ||||
| ispPAC-POWR6AT6 | In-System Programmable Power Supply Monitoring and Margining Controller | 32 QFNS | Datasheet | ||||
| ispPAC-POWR607 | In-System Programmable Power Supply Supervisor,Reset Generator and Watchdog Timer | 32 QFNS | Datasheet | ||||
| ProcessorPM-POWR605 | In-System Programmable Power Supply Supervisor,Reset Generator and Watchdog Timer with Power Down Feature | 24 QFN | Datasheet | ||||
| ispClock | ispClock5600/A | Clock Generator and Universal Fan-out Buffer | 100 TQFP 48 TQFP |
Datasheet | |||
| ispClock5400D | In-System Programmable, Ultra-Low Jitter, Zero Delay and Fan-Out Buffer, Differential |
48 QFNS |
Datasheet | ||||
| ispClock5300S | In-System Programmable, Zero-Delay Universal Fan-Out Buffer, Single-Ended | 48 TQFP 64 TQFP |
Datasheet | ||||
| ispLSI 1000E | ispLSI 1016E ispLSI 1032E ispLSI 1048E |
5V In-System Programmable High Density PLD | 44 TQFP 44 PLCC 84 PLCC 100 TQFP 128 TQFP 128 PQFP |
Datasheet Datasheet Datasheet |
|||
| ispLSI 2000VE | ispLSI 2032VE ispLSI 2064VE ispLSI 2096VE ispLSI 2128VE ispLSI 2192VE |
3.3V In-System Programmable High Density SuperFAST PLD | 176 TQFP 128 TQFP 100 TQFP 44 TQFP 48 TQFP |
208 fpBGA | Datasheet Datasheet Datasheet Datasheet Datasheet |
||
| ispLSI 2000A | ispLSI 2032A ispLSI 2064A ispLSI 2096A ispLSI 2128A |
5V In-System Programmable High Density PLD | 44 PLCC 44 TQFP 48 TQFP 100 TQFP 84 PLCC 128 PQFP 128 TQFP 160 PQFP 176 TQFP |
Datasheet Datasheet Datasheet Datasheet |
|||
| ispMACH 4A3 | M4A3-32 M4A3-64 M4A3-128 M4A3-192 M4A3-256 M4A3-384 M4A3-512 |
High Performance, E2CMOS 3.3V CPLD Family | 44 PLCC 144 TQFP 100 TQFP 48 TQFP 44 TQFP 208PQFP |
256 fpBGA | Datasheet | ||
| ispMACH 4A5 | M4A5-32 M4A5-64 M4A5-128 M4A5-192 |
High Performance, E2CMOS 5V CPLD Family | 44 PLCC 144 TQFP 100 TQFP 100 PQFP 48 TQFP 44 TQFP 208 PQFP |
Datasheet | |||
| ispGDXVA | ispGDX80VA ispGDX160VA ispGDX240VA |
3.3V In-System Programmable Generic Digital Crosspoint | 100 TQFP | 208 fpBGA 388 fpBGA |
Datasheet Datasheet Datasheet |
||
1 Supported for MachXO2-ZE only. Please contact your Lattice sales representative for support of WLCSP packages.
2 Supported for MachXO2-ZE and MachXO2-HC.
3 Also Halogen Free.
4 XO2-4000HE only
Note: Reference appropriate datasheet for valid part number and package combinations.
All of Lattice's RoHS compliant TQFP, PLCC, PQFP and QFNs packages are "backward compatible" with conventional leaded manufacturing methodologies. This backward compatibility allows users to surface mount lead free and halogen free packages onto lead based-PCBs and/or use lead free and halogen free packaging with lead containing solders. Users can now procure a single, lead-free or halogen-free component from Lattice and use it in either a leaded or lead free manufacturing environment without any issues. This capability greatly simplifies the inventory management challenges associated with migration from conventional lead based to lead free manufacturing.
Lattice's RoHS compliant packages are qualified to Level 1, 3 or 4 moisture resistance depending on the package type with peak reflow temperatures of 260°C, 250°C or 245°C, consistent with IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. Reliability tests include high temperature operating life (HTOL), surface mount preconditioning testing, temperature cycling, moisture resistance testing, biased highly accelerated stress test (HAST) and unbiased HAST. Lattice lead free products are qualified to the reflow profiles described in TN1076 - Solder Reflow Guide for Surface Mount Devices.
| Lead-Free Peak Reflow Temp. | Moisture Sensitivity Level (MSL) | Package |
|---|---|---|
| 260 +0/-5°C | 1 | 24-/32-QFNS |
| 3 |
TQFP, csBGA, ucBGA, 256-caBGA, 48-/64-QFNS, 100-fpBGA, 208-ftBGA, 256-ftBGA (Option 1), 324-ftBGA |
|
| 250 +0/-5°C | 1 | 20-PLCC |
| 3 | 332-caBGA, fpBGA (>208 balls), 256-ftBGA (Option 2) | |
| 245 +0/-5°C | 1 | 28-PLCC |
| 3 | PQFP,44-PLCC | |
| 4 | fcBGA, 84-PLCC |
For more information, click on a link below to download an Adobe PDF document.
© Lattice Semiconductor Corporation 2013
