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Lead Free, Halogen Free (RoHS Compliant) Packaging Support From Lattice

Lattice chip with blue sky"Lattice Semiconductor is committed to conducting business in a manner consistent with the efficient use of resources and materials, and the preservation of the natural environment."

Corporate Commitment

Due to increased worldwide environmental concerns, the need for lead free and haolgen free solutions in electronic components and systems is receiving increasing attention within the semiconductor and electronics industries. Lattice is fully supportive of the various industry efforts throughout the world to phase out the use of lead and other undesirable elements from electronic equipment materials and manufacturing processes.

Lattice remains committed to continually reducing its impact on the world's natural environment and works closely with our customers and suppliers to identify and rapidly eliminate hazardous substances from its products.

Resource Conservation

Environmental protection is more than just meeting standards. All corporate activities must be implemented with the environment in mind. Lattice's goal is to develop all new products such that they reduce space, materials and power consumption for an equivalent electrical function. In turn, this allows our customers to continually reduce their impact on the environment.

ISO14001

ISO14001 is an international standard for environmental management systems. Companies that are ISO14001 registered have demonstrated an internal program for the management of hazardous waste and implementation of recycling programs. This international recognition certifies a company's commitment to preserving the natural environment. All Lattice subcontract manufacturers are ISO14001 registered, and are routinely reviewed to ensure continued compliance.

Lead Free and Halogen Free (RoHS Compliant) Packaging Initiative

Lattice Semiconductor is a leader in the development of green packaging solutions. Lattice currently offers an extensive list of standard products in lead free and halogen free packaging.

Lattice's lead free and halogen free products are fully RoHS compliant, meeting the European Parliament Directive entitled "Restrictions on the use Of Hazardous Substances" (RoHS). This Directive prohibits the use of the following elements in electrical/electronic equipment sold after 7/1/2006: cadmium (Cd), lead (Pb), mercury (Hg), hexavalent chromium (Cr(VI)), polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs). Lattice's lead free and halogen free products are compliant with this Directive today, well ahead of the July, 2006 deadline.

 

 

Lattice's Green Packaging Solutions

Lattice has qualified a wide variety of package types in lead free and halogen free configurations. These qualified packages include the Plastic Leaded Chip Carrier (PLCC), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Fine Pitch BGA (fpBGA), Fine Pitch Thin BGA (ftBGA), Chip Array BGA (caBGA), Chip Scale BGA (csBGA), Ultra Chip Scale BGA (ucBGA), Flip Chip BGA (fcBGA), Quad Flat-Pack No Lead Saw-Singulated (QFNS) and Wafer Level Chip Scale Packaging (WLCSP). To better facilitate the industry transition to lead-free and halogen-free PLDs, Lattice offers the following broad assortment of standard, off-the-shelf, product families in green packages.

Lead Free Product Family Selector Guide
Product Family Device Family Description Halogen-Free (RoHS6/6) Lead-Free (RoHS6/6) Related Literature
Backwards Compatible Standard Backwards Compatible Standard
 MachXO2 
 
 
MachXO2 "ZE" 1.2V Low-Power, Do-it-All PLD

100 TQFP
144 TQFP

25 WLCSP 1
36 WLCSP 1
64 ucBGA 2
132 csBGA 
256 caBGA 
256 ftBGA 
332 caBGA 
484 fpBGA 

  

 

  Datasheet
MachXO2 "HC" 2.5/3.3V High Performance, Do-it-All PLD
MachXO2 "HE" 1.2V High Performance, Do-it-All PLD
 LatticeXP2  LatticeXP2 1.2V Low-Cost, Non-Volatile FPGA with flexiFLASH Architecture and Live Update Technology     144 TQFP
  208 PQFP
132 csBGA
256 ftBGA
484 fpBGA
672 fpBGA
Datasheet
 LatticeSC  LatticeSC 1.2/1.0V High Performance FPGA       256 fpBGA
900 fpBGA
1020 fcBGA
1152 fcBGA
1704 fcBGA 
Datasheet
 LatticeSCM 1.2/1.0V High Performance FPGA with Maco Block
LatticeECP3 LatticeECP3 1.2V Low-Power, High Value FPGA for High-Volume Applications       256 ftBGA
484 fpBGA
672 fpBGA
1156 fpBGA
Datasheet
LatticeECP2/M LatticeECP2 1.2V Low-Cost FPGA, High End Feature Set for High-Volume Applications     144 TQFP
208 PQFP
256 fpBGA
484 fpBGA
672 fpBGA
900 fpBGA
Datasheet
LatticeECP2M 1.2V Low-Cost FPGA with SERDES, High End Feature Set for High-Volume Applications       256 fpBGA
484 fpBGA
672 fpBGA
900 fpBGA
1152 fpBGA
Datasheet
MachXO MachXO "C" 1.8/2.5/3.3V Most Versatile Non-Volatile PLD     100 TQFP
144 TQFP 

100 csBGA
132 csBGA
256 caBGA
256 ftBGA
324 ftBGA

Datasheet
MachXO "E" 1.2V Most Versatile Non-Volatile PLD
LA-MachXO "C" AEC-Q100 Qualified 1.8/2.5/3.3V Most Versatile Non-Volatile PLD     100 TQFP
144 TQFP 
256 ftBGA
324 ftBGA
Datasheet
LA-MachXO "E" AEC-Q100 Qualified 1.2V Most Versatile Non-Volatile PLD
LatticeXP LatticeXP "C" 1.8/2.5/3.3V Low-Cost, Non-Volatile FPGAs with TransFR Technology     100 TQFP
144 TQFP
208 PQFP
256 fpBGA
388 fpBGA
484 fpBGA 
Datasheet
LatticeXP "E" 1.2V Low-Cost, Non-Volatile FPGAs with TransFR Technology
LatticeECP/EC LatticeECP-DSP 1.2V Low-Cost FPGA with High Performance Embedded DSP     208 PQFP
100 TQFP
144 TQFP
256 fpBGA
484 fpBGA
672 fpBGA
Datasheet
LatticeEC 1.2V Low-Cost FPGA for High-Volume Applications
ispXPGA ispXPGA-B/EB 3.3/2.5V Non-Volatile, Infinitely Reconfigurable FPGA       256 fpBGA Datasheet
ispGDX2 ispGDX2-V/EV 3.3V High Performance Digital Crosspoint Switch       100 fpBGA
208 fpBGA
484 fpBGA
Datasheet
ORCA 4 FPSC ORT82G5/42G5
ORSO82G5/42G5
ORT8850H
ORT8850L
 
1.5V ORCA 4 FPGA Plus Embedded High-Performance ASIC Core       484 fpBGA
680 fpBGA
Datasheet
Datasheet
Datasheet
Datasheet
 
ispMACH 4000 ispMACH 4000ZE 1.8V Ultra-Low Power CPLD     48 TQFP3
100 TQFP3
144 TQFP3 
64 csBGA3
144 csBGA
Datasheet
ispMACH 4000Z 1.8V SuperFAST Zero-Power CPLD
 
  48 TQFP
100 TQFP
176 TQFP
56 csBGA
132 csBGA 
Datasheet
ispMACH 4000V 3.3V SuperFAST Low-Power CPLD
 
  44 TQFP
48 TQFP
100 TQFP
128 TQFP
144 TQFP
176 TQFP
256 ftBGA
ispMACH 4000B 2.5V SuperFAST Low-Power CPLD
ispMACH 4000C 1.8V SuperFAST Low-Power CPLD
LA-ispMACH 4000Z AEC-Q100 Qualified 1.8V SuperFAST Zero-Power CPLD     48 TQFP
100 TQFP
  Datasheet
LA-ispMACH 4000V AEC-Q100 Qualified 3.3V SuperFAST Low-Power CPLD
 
  44 TQFP
48 TQFP
100 TQFP
128 TQFP
144 TQFP
  Datasheet
ispXPLD 5000MX ispXPLD 5000MV 3.3V High Density CPLD + Memory     208 PQFP  256 fpBGA
484 fpBGA
672 fpBGA
Datasheet
ispXPLD 5000MB 2.5V High Density CPLD + Memory
Platform Manager Platform Manager In-System Programmable Power Supply Monitoring, Sequencing and Margining Controller 128 TQFP 208 ftBGA      Datasheet
ispPAC-POWR ispPAC-POWR1220AT8 In-System Programmable Power Supply Monitoring, Sequencing and Margining Controller     100 TQFP   Datasheet
ispPAC-POWR1014/A In-System Programmable Power Supply Supervisor, Reset Generator and Sequencing Controller     48 TQFP   Datasheet
ispPAC-POWR6AT6 In-System Programmable Power Supply Monitoring and Margining Controller     32 QFNS   Datasheet
ispPAC-POWR607 In-System Programmable Power Supply Supervisor,Reset Generator and Watchdog Timer     32 QFNS   Datasheet
ProcessorPM-POWR605 In-System Programmable Power Supply Supervisor,Reset Generator and Watchdog Timer with Power Down Feature      24 QFN    Datasheet 
ispClock ispClock5600/A Clock Generator and Universal Fan-out Buffer     100 TQFP
48 TQFP
  Datasheet
ispClock5400D In-System Programmable, Ultra-Low Jitter, Zero Delay and Fan-Out Buffer, Differential     

48 QFNS
64 QFNS 

  Datasheet 
ispClock5300S In-System Programmable, Zero-Delay Universal Fan-Out Buffer, Single-Ended     48 TQFP
64 TQFP
  Datasheet
ispLSI 1000E ispLSI 1016E
ispLSI 1032E
ispLSI 1048E
5V In-System Programmable High Density PLD     44 TQFP
44 PLCC
84 PLCC
100 TQFP
128 TQFP
128 PQFP
  Datasheet
Datasheet
Datasheet
ispLSI 2000VE ispLSI 2032VE
ispLSI 2064VE
ispLSI 2096VE
ispLSI 2128VE
ispLSI 2192VE
3.3V In-System Programmable High Density SuperFAST PLD     176 TQFP
128 TQFP
100 TQFP
44 TQFP
48 TQFP
208 fpBGA Datasheet
Datasheet
Datasheet
Datasheet
Datasheet
ispLSI 2000A ispLSI 2032A
ispLSI 2064A
ispLSI 2096A
ispLSI 2128A
5V In-System Programmable High Density PLD     44 PLCC
44 TQFP
48 TQFP
100 TQFP
84 PLCC
128 PQFP
128 TQFP
160 PQFP
176 TQFP
  Datasheet
Datasheet
Datasheet
Datasheet
ispMACH 4A3 M4A3-32
M4A3-64
M4A3-128
M4A3-192
M4A3-256
M4A3-384
M4A3-512
High Performance, E2CMOS 3.3V CPLD Family     44 PLCC
144 TQFP
100 TQFP
48 TQFP
44 TQFP
208PQFP
256 fpBGA Datasheet
ispMACH 4A5 M4A5-32
M4A5-64
M4A5-128
M4A5-192
High Performance, E2CMOS 5V CPLD Family     44 PLCC
144 TQFP
100 TQFP
100 PQFP
48 TQFP
44 TQFP
208 PQFP 
  Datasheet
ispGDXVA ispGDX80VA
ispGDX160VA
ispGDX240VA
3.3V In-System Programmable Generic Digital Crosspoint     100 TQFP 208 fpBGA
388 fpBGA
Datasheet
Datasheet
Datasheet

1 Supported for MachXO2-ZE only. Please contact your Lattice sales representative for support of WLCSP packages.

2 Supported for MachXO2-ZE and MachXO2-HC.

3 Also Halogen Free.

Note: Reference appropriate datasheet for valid part number and package combinations.
 

Backward Compatible Packages

All of Lattice's RoHS compliant TQFP, PLCC, PQFP and QFNs packages are "backward compatible" with conventional leaded manufacturing methodologies. This backward compatibility allows users to surface mount lead free and halogen free packages onto lead based-PCBs and/or use lead free and halogen free packaging with lead containing solders. Users can now procure a single, lead-free or halogen-free component from Lattice and use it in either a leaded or lead free manufacturing environment without any issues. This capability greatly simplifies the inventory management challenges associated with migration from conventional lead based to lead free manufacturing.
 

Lead Free and Halogen Free Reflow Profile

Lattice's RoHS compliant packages are qualified to Level 1, 3 or 4 moisture resistance depending on the package type with peak reflow temperatures of 260°C, 250°C or 245°C, consistent with IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. Reliability tests include high temperature operating life (HTOL), surface mount preconditioning testing, temperature cycling, moisture resistance testing, biased highly accelerated stress test (HAST) and unbiased HAST. Lattice lead free products are qualified to the reflow profiles described in TN1076 - Solder Reflow Guide for Surface Mount Devices.

 

Lead-free reflow graph

 

Lead-Free Peak Reflow Temp. Moisture Sensitivity Level (MSL) Package
260 +0/-5°C  1 24-/32-QFNS
3

TQFP, csBGA, ucBGA, 256-caBGA, 48-/64-QFNS,

100-fpBGA, 208-ftBGA, 256-ftBGA (Option 1), 324-ftBGA

250 +0/-5°C 1 20-PLCC
3 332-caBGA, fpBGA (>208 balls), 256-ftBGA (Option 2)
245 +0/-5°C 1 28-PLCC
3 PQFP,44-PLCC
4 fcBGA, 84-PLCC

More Information

For more information, click on a link below to download an Adobe PDF document.

 

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