Advanced Packaging

IC packaging has become a critical aspect in the design and development of today's high-speed, high-quality electronic systems. Lattice Semiconductor is meeting this challenge by engineering cutting-edge BGA and TQFP packages, which exceed the exacting standards of even the most demanding applications.

Lattice Semiconductor offers the most advanced portfolio of innovative packaging solutions available today. Users are able to choose from a variety of high pin count packages:

• Download Lattice packaging diagrams
• BGA Packages (Plastic Ball Grid Array)
  • Ball pitch options now available include:
    • 1.27mm plastic BGA (BGA)
    • 1.00mm fine pitch BGA (fpBGA)
    • 1.00mm BGA (ft BGA)
    • 1.00mm flip chip BGA (fcBGA)
    • 0.8mm chip array BGA (caBGA)
    • 0.5mm chip scale BGA (csBGA)
    • 0.4mm ultra chip scale BGA (ucBGA)
  • Lattice Semiconductor BGA packages provide...
    • Greater mis-alignment tolerance
    • Less susceptibility to co-planarity
    • Easier PCB routing
• TQFP Packages (Thin Quad Flat Pack)
  • 44-pin to 176-pin options now available
• Reflow Temperature Guidelines and Moisture Sensitivity

Combining Lattice Semiconductor advanced packaging solutions with In-System Programmability (ISP) and Boundary Scan Test allows mounted ISP Devices to be programmed and tested for pin continuity all at once.