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Advanced Packaging

IC packaging has become a critical aspect in the design and development of today's high-speed, high-quality electronic systems. Lattice Semiconductor is meeting this challenge by engineering cutting-edge BGA and TQFP packages, which exceed the exacting standards of even the most demanding applications.

Lattice Semiconductor offers the most advanced portfolio of innovative packaging solutions available today. Users are able to choose from a variety of high pin count packages:

Combining Lattice Semiconductor advanced packaging solutions with In-System Programmability (ISP) and Boundary Scan Test allows mounted ISP Devices to be programmed and tested for pin continuity all at once.


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