Medical ultrasound equipment, through the ultrasound probe, transmits analog signal (2 to 20 MHz) into the body and uses the reflected signal from various organs in the body to reconstruct the images of the internal organs of the body. The reconstructed image is then displayed on the operator console.
Body tissues reflect the signals generated by the transmit beam forming card. Each channel of the receive channel card amplifies the received signal and converts the signals using a high speed A/D converter. The digital data from all the channels are then used in receive-beam-forming process. The number of channels on a receive channel card depends on the system architecture.
The high speed back plane connects transmit and receive channel cards to the main system controller. The system control card receives the beam formed receive signal from each card, enhances the image depending on the mode of operation, and displays the enhanced image on the operator console CRT.
Devices Used
Transmit Beam Forming Card
Functions
- Transmits high voltage signal through the ultrasound probe
- Transmit beam forming
- Communicate with the system control board through high speed back plane
Functions Performed
- DSP FIR, IIR Filter and other DSP functions
- Interface to Transmit DAC
- Glue Logic: Bus state machine, direct memory interface, etc.
Lattice Advantages
- Easy customization of Algorithm for product differentiation
- Increases DSP throughput
- On-Chip PLL for timing control and pipelining
Functions Performed
- 3.7Gbps SERDES
- Direct data transfer between memory and back plane
- Glue Logic
Lattice Advantages
- Easy customization of Algorithm for product differentiation
- Reduced board space by integrating board level glue logic
- High speed removes back plane performance bottleneck
Receive Channel Card
Functions
- A/D conversion of all received signals
- Receive beam forming
- Send image to main system board
- Back plane interface
Functions Performed
- Customizable DSP FIR and IIR Filter
- Interface to ADC
- Glue Logic: FIFO, Memory Interface, etc.
Lattice Advantages
- Easy customization of Algorithm
- High speed FPGA fabric for various glue logic
- High speed buffer management
- ADC driver
- Multiple high performance MAC (Multiply & Accumulate primitive)
- Increases DSP throughput
- On-Chip PLL for timing control and pipelining
Functions Performed
- 3.7Gbps SERDES
- Direct data transfer between memory and back plane
- Glue Logic
Lattice Advantages
- Increased reliability due to high performance SERDES
- Reduced board space by integrating board level glue logic
- High speed serial interface removes back plane performance bottleneck
Functions Performed
- CPU bus interface state machines
- Multi-port memory interface for ORT42G5, co-processor FPGA, and CPU
- SDRAM interface
Lattice Advantages
- Improves performance of DSP CPU operation without wait states
- Multi-port SDRAM drive without performance degradation
- FIFO for mixing and matching the processing and data transfer rates
Main Control Card
Functions
- Image Processing and Displaying
- Spectral Doppler Processing (D Mode)
- Imaging and Motion Processing (B Mode)
- Color Doppler Processing (F Mode)
- Audio Processing
- Beam Forming Central Control
- Operator Console Interface
Functions Performed
- Customizable DSP FIR and IIR Filter
- Interface to ADC
- Glue Logic: FIFO, Memory Interface, etc.
Lattice Advantages
- Easy customization of Algorithm
- High speed FPGA fabric for Various glue logic
- High speed Buffer Management
- Multiple High performance MAC (Multiply & Accumulate primitive)
- Increases DSP throughput
- On-Chip PLL for timing Control and Pipelining
Functions Performed
- CPU bus interface state machines
- Multi-port memory interface for ORT42G5, Co-processor FPGA, and CPU
- SDRAM interface
Lattice Advantages
- Improves performance of DSP CPU operation without wait states
- Multi-port SDRAM drive without performance degradation
- FIFO for mixing and matching the processing and data transfer rates
Functions Performed
- 3.7Gbps SERDES
- Direct data transfer between memory and back plane
- Glue Logic
Lattice Advantages
- Increased reliability due to high performance SERDES
- Reduced board space by integrating board level glue logic
- High speed serial interface removes back plane performance bottleneck
© Lattice Semiconductor Corporation 2012
