Lattice Press Release

Lattice Semiconductor and Mikroprojekt Deliver Advanced System Development Platform for the Network Edge

New ECP5™ FPGA-based Board Enables Smart Connectivity for HetNet and Industrial IoT Applications

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  • Kondor AX development platform features Lattice’s low power, small form factor ECP5 FPGA for programmable connectivity and compute acceleration
  • Platform’s rich set of external interfaces combined with Linux OS support enables rapid design of applications including small cells, IP cameras, and IoT gateways

Portland, OR – November 2, 2015 – Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, and Mikroprojekt today announced availability of a new ECP5™-based development platform to accelerate system design of communications and industrial applications at the network edge, including HetNet small cells, industrial IoT gateways, and IP cameras. Mikroprojekt’s Kondor AX development platform features Lattice’s ECP5 device, a low power, small form factor FPGA with flexible interface connectivity and high-performance DSP for image filtering and data analytics; and a versatile discrete CPU with Linux OS support for system control.

“There is a growing need for smart connectivity and computing at the network edge, from HetNet small cells, microservers, and millimeter wave backhaul applications in communications, to IP video surveillance cameras, HMI displays, and IoT gateways in the industrial market. System designers of such applications are typically challenged with stringent power consumption, form factor, and cost requirements,” said Deepak Boppana, director, product marketing at Lattice Semiconductor. “The Kondor AX development platform featuring Lattice’s low power, small form factor ECP5 FPGA enables designers to easily implement programmable connectivity and compute acceleration in these applications.”

The ECP5 FPGA supports many popular interface standards, including CPRI, JESD204B and PCI Express. To facilitate connecting the platform to networks, displays, and other peripherals, the platform features several standard interfaces like HDMI, Gigabit Ethernet, USB OTG, FMC, SFP, LVDS and GPIO. The development platform also bundles a Linux-based operating system with a large existing base of applications and software libraries.

“We are excited to partner with Lattice to deliver an advanced development platform that meets connectivity requirements for emerging applications such as HetNet and IoT,” said Damir Jezic, managing director at Mikroprojekt. “By combining Lattice’s robust ECP5 FPGA with support for a broad set of external interfaces, the Kondor AX platform will enable our customers to accelerate their network edge system design.”

The Kondor AX development platform is available for purchase from Mikroprojekt. For more information, visit:

Visit Lattice’s booth #705 at Small Cells Americas from November 3-4, 2015 in Dallas for live demos including small cells and millimeter wave backhaul.

About Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the global leader in smart connectivity solutions, providing market leading intellectual property and low-power, small form-factor devices that enable more than 8,000 global customers to quickly deliver innovative and differentiated cost and power efficient products. The Company’s broad end-market exposure extends from consumer electronics to industrial equipment, communications infrastructure and licensing.

Lattice was founded in 1983 and is headquartered in Portland, Oregon. In March 2015, the Company acquired Silicon Image, which is a leader in setting industry standards including the highly successful HDMI®, DVI™, MHL® and WirelessHD® standards.

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Lattice Semiconductor Corporation, Lattice Semiconductor (& design), L (& design), HDMI, DVI, MHL, WirelessHD, ECP5, and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.

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