Device Material Content

If you require Material Composition Declarations for Lattice devices in IPC 1752-2 format, click here.

TQFP | fpBGA | ftBGA | PDIP | PLCC | PQFP | SOIC | SBGA
fcBGA | fpSBGA |SSOP | PBGA | caBGA | csBGA | ucBGA | QFN

TQFP
Lead-Free (matte Sn plated)
44 TQFP 1.4mm (LQFP) Pb-Free Device Material Content - matte Sn plated
44 TQFP 1.0mm Pb-Free Device Material Content - matte Sn plated
48 TQFP 1.4mm (LQFP) Pb-Free Device Material Content - matte Sn plated
48 TQFP 1.0mm Pb-free Device Material Content - matte Sn plated
64 TQFP 1.4mm Pb-free Device Material Content - matte Sn plated
100 TQFP 1.4mm (LQFP) Pb-Free Device Material Content - matte Sn plated
128 TQFP 1.4mm (LQFP) Pb-Free Device Material Content - matte Sn plated
144 TQFP 1.4mm (LQFP) Pb-Free Device Material Content - matte Sn plated
176 TQFP 1.4mm (LQFP) Pb-Free Device Material Content - matte Sn plated
Leaded
44 TQFP 1.0mm Device Material Content
44 TQFP 1.4mm (LQFP) Device Material Content
48 TQFP 1.4mm (LQFP) Device Material Content
48 TQFP 1.0mm Device Material Content
64 TQFP 1.4mm Device Material Content
100 TQFP (LQFP) Device Material Content
128 TQFP 1.4mm (LQFP) Device Material Content
144 TQFP (LQFP) Device Material Content
176 TQFP (LQFP) Device Material Content
Lead-Free (SnBi plated)
No longer manufactured - data available upon request
fpBGA
Lead-Free
100 fpBGA Pb-Free Device Material Content
208 fpBGA Pb-Free Device Material Content
256 fpBGA Pb-Free Device Material Content
256 fpBGA Pb-Free Device Material Content (90nm products)
388 fpBGA Pb-Free Device Material Content
484 fpBGA Pb-Free Device Material Content
484 fpBGA Pb-Free Device Material Content (90nm products)
516 fpBGA Pb-Free Device Material Content
672 fpBGA Pb-Free Device Material Content
672 fpBGA Pb-Free Device Material Content (90 nm products)
680 fpBGA Pb-Free Device Material Content
900 fpBGA Pb-Free Device Material Content
900 fpBGA Pb-Free Device Material Content (90nm products)
1156 fpBGA Pb-Free Device Material Content
Leaded
100 fpBGA Device Material Content
144 fpBGA Device Material Content
208 fpBGA Device Material Content
256 fpBGA Device Material Content
256 fpBGA Device Material Content (90nm products)
388 fpBGA Device Material Content
484 fpBGA Device Material Content
484 fpBGA Device Material Content (90nm products)
516 fpBGA Device Material Content
516 fpBGA w/Heatsink Device Material Content
672 fpBGA Device Material Content
672 fpBGA Device Material Content (90nm products)
676 fpBGA Device Material Content
680 fpBGA Device Material Content
680 fpBGA w/Heatsink Device Material Content
900 fpBGA Device Material Content
1156 fpBGA Device Material Content
ftBGA
Lead-Free
256 ftBGA Pb-Free Device Material Content
324 ftBGA Pb-Free Device Material Content
Leaded
256 ftBGA Device Material Content
324 ftBGA Device Material Content
PDIP
Lead-Free
20 PDIP Pb-Free Device Material Content
24 PDIP Pb-Free Device Material Content
28 PDIP Pb-Free Device Material Content
Leaded
16 PDIP Device Material Content
20 PDIP Device Material Content
24 PDIP Device Material Content
28 PDIP Device Material Content
PLCC
Lead-Free
20 PLCC Pb-Free Device Material Content
28 PLCC Pb-Free Device Material Content
44 PLCC Pb-Free Device Material Content
84 PLCC Pb-Free Device Material Content
Leaded
20 PLCC Device Material Content
28 PLCC Device Material Content
44 PLCC Device Material Content
68 PLCC Device Material Content
84 PLCC Device Material Content
PQFP
Lead-Free
100 PQFP Pb-Free Device Material Content
128 PQFP Pb-Free Device Material Content
208 PQFP Pb-Free Device Material Content
Leaded
100 PQFP Device Material Content
128 PQFP Device Material Content
144 PQFP Device Material Content
160 PQFP Device Material Content
208 PQFP Device Material Content
240 PQFP Device Material Content
304 PQFP Device Material Content
SOIC
Leaded
16 SOIC Device Material Content
20 SOIC Device Material Content
24 SOIC Device Material Content
28 SOIC Device Material Content
SBGA
Lead-Free
432 SBGA Pb-Free Device Material Content
Leaded
256 SBGA Device Material Content
352 SBGA Device Material Content
432 SBGA Device Material Content
fcBGA
Lead-Free
1020 fcBGA Pb-Free Device Material Content*
1152 fcBGA Pb-Free Device Material Content
1704 fcBGA PB-Free Device Material Content
* Pb in solder bumping is compliant with EU RoHS per exemption 15.
Leaded
1020 fcBGA Device Material Content
1152 fcBGA Device Material Content
1704 fcBGA Device Material Content
fpSBGA
Lead-Free
680 fpSBGA Pb-Free Device Material Content
Leaded
680 fpSBGA Device Material Content
1036 fpSBGA Device Material Content
SSOP
Leaded
28 SSOP Device Material Content
PBGA
Lead-Free
272 PBGA Pb-Free Device Material Content
Leaded
272 PBGA Device Material Content
388 PBGA Device Material Content
caBGA
Lead-Free
100 caBGA Pb-Free Device Material Content
Leaded
49 caBGA Device Material Content
100 caBGA Device Material Content
csBGA
Lead-Free
56 csBGA Pb-Free Device Material Content
64 csBGA Pb-Free Device Material Content
100 csBGA Pb-Free Device Material Content
132 csBGA Pb-Free Device Material Content
144 csBGA Pb-Free Device Material Content
Leaded
56 csBGA Device Material Content
100 csBGA Device Material Content
132 csBGA Device Material Content
ucBGA
Lead-Free
32 64 ucBGA Pb-Free Device Material Content
32 132 ucBGA Pb-Free Device Material Content
QFN
Lead-Free
32 QFN Pb-Free Device Material Content
Leaded
32 QFN Device Material Content