Lattice Solutions

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  • USB3-GbE VIP IO开发板

    Board

    USB3-GbE VIP IO开发板

    适用于视频接口平台(VIP)的USB 3.0 和千兆以太网输出板
    USB3-GbE VIP IO开发板
  • ECP5评估板

    Board

    ECP5评估板

    售价仅为99美元的ECP5评估板拥有一片85K LUT的ECP5-5G FPGA;可轻松访问大多数I/O以及SERDES;更支持Arduino和Raspberry Pi以及通用接口以提高可用性。
    ECP5评估板
  • 人脸识别

    Reference Design

    人脸识别

    在ECP5 FPGA上使用卷积神经网络检测人脸,并与已注册的人脸进行匹配。可以用于识别其他任何对象。
    人脸识别
  • 对象计数

    Reference Design

    对象计数

    基于莱迪思sensAI的对象计数应用示例。包括SPI、DDR IP模块、ISP引擎、8个CNN引擎和一个计数/标记叠加(overlay)引擎。
    对象计数
  • Human Face Identification

    Demo

    Human Face Identification

    Register and identify faces without retraining, eliminating the need for uploading images and lengthy retraining using a GPU.
    Human Face Identification
  • 人员侦测

    Demo

    人员侦测

    Uses an artificial intelligence (AI) algorithm to detect human presence with either the powerful ECP5 FPGA, or small, low-power iCE40 UltraPlus FPGA.
    人员侦测
  • 包裹检测

    Demo

    包裹检测

    使用YOLO CNN,在莱迪思ECP5 FPGA嵌入式视觉开发套件上实现包裹检测。
    包裹检测
  • 车辆分类

    Demo

    车辆分类

    使用YOLO CNN,在莱迪思ECP5 FPGA嵌入式视觉开发套件上实现车辆分类。
    车辆分类
  • DisplayPort IP核

    IP Core

    DisplayPort IP核

    Lattice has partnered with Bitec to bring the DisplayPort 1.4a compliant IP Core (with eDP 1.4 support) to the ECP5 FPGA. Supports resolutions of up to 1080p60
    DisplayPort IP核
  • Board

    DisplayPort VIP输入板

    适用于DisplayPort 1.4a IP(包括eDP 1.4)
    DisplayPort VIP输入板
  • Board

    DisplayPort VIP输出板

    Expands the Lattice VIP board ecosystem to support DisplayPort 1.4a (DP) video output - up to 4 lanes at 1.62 or 2.7 Gbps.
    DisplayPort VIP输出板
  • DisplayPort发送器演示示例

    Demo

    DisplayPort发送器演示示例

    Bitec适用于低功耗、批量低价ECP5的DisplayPort 1.4a接口
    DisplayPort发送器演示示例
  • DisplayPort接收器演示示例

    Demo

    DisplayPort接收器演示示例

    适用于低功耗、批量价低ECP5的DisplayPort 1.4a接口
    DisplayPort接收器演示示例
  • 三倍速以太网MAC

    IP Core

    三倍速以太网MAC

    在主机处理器和以太网之间发送和接收数据。符合IEEE 802.3标准。支持10/100/1000 Mbps传输速率。
    三倍速以太网MAC
  • 3D深度测绘

    Demo

    3D深度测绘

    Determines the distance between an embedded device and an object using a Semi-Global Block Matching (SGBM) algorithm to determine 64 different disparity levels
    3D深度测绘
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