LatticeECP3

高效,适用于创新,采用小尺寸的紧凑型封装

非常高效的性能——在尽可能小的空间内实现所有功能是至关重要的,拥有150K LUT的LatticeECP3可满足您的需求

最大的可靠性,最低的成本和功耗——LatticeECP3 FPGA带有片上SERDES以及低至0.5W的功耗,助您提高工业、远程通信或车用设备的可靠性并且降低成本

易于互连的FPGA——使用合适协议的SERDES,合适接口的I/O,使用LatticeECP3满足您的系统连接和扩展需求

特性

  • 多达16个通道,速率为3.125 Gbps
  • 800 Mbps DDR3,1Gbps LVDS
  • 多达586个可编程sysIO缓冲器,支持PCI Express、以太网(GbE、XAUI & SGMII)、HDMI、SMPTE、串行Rapid I/O、CPRI和JESD204A/B等等
  • 高达150K LUT以及6.8 Mbit的SRAM
  • 多种封装选择,尺寸小至10.0 mm x 10.0 mm,功耗低至0.5 W以下

跳转到

产品系列表

LatticeECP3 器件选型指南

参数 ECP3-17 ECP3-35 ECP3-70 ECP3-95 ECP3-150
LUT (K) 17 33 67 92 149
EBR SRAM 块 38 72 240 240 372
EBR SRAM (Kbit) 700 1327 4420 4420 6850
分布式RAM (Kbit) 36 68 145 188 303
18 x 18 乘法器 24 64 128 128 320
3.2 Gbps SERDES 通道 4 4 12 12 16
PLL + DLL 2+2 4+2 10+2 10+2 10+2
DDR 支持 DDR3 800, DDR2 533, DDR 400
引导闪存 外部 外部 外部 外部 外部
双引导
位流加密
内核电压 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Temp C
Temp I
Temp AEC-Q100 - - -
0.5 mm 引脚间距 I/O 数量 / SERDES
  ECP3-17 ECP3-35 ECP3-70 ECP3-95 ECP3-150
328-ball csBGA (10 x 10 mm) 116 / 2
1.0 mm 引脚间距 I/O 数量 / SERDES
  ECP3-17 ECP3-35 ECP3-70 ECP3-95 ECP3-150
256-ball ftBGA (17 x 17 mm) 133 / 4 133 / 4
484-ball fpBGA (23 x 23 mm) 222 / 4 295 / 4 295 / 4 295 / 4
672-ball fpBGA (27 x 27 mm) 310 / 4 380 / 8 380 / 8 380 / 8
1156-ball fpBGA (35 x 35 mm) 490 / 12 490 / 12 586 / 16

莱迪思车用(AEC-Q100认证) LatticeECP3 器件选型指南

参数 LA-ECP3-17 LA-ECP3-35
LUT (K) 17 33
EBR SRAM (Kbit) 700 1327
EBR SRAM 块 38 72
分布式RAM (Kbit) 36 68
18 x 18 乘法器 24 64
3.2 Gbps SERDES 通道 4 4
最多可用 I/O 222 310
PLL + DLL 2+2 4+2
0.5 mm 引脚间距 I/O 数量 / SERDES
  LA-ECP3-17 LA-ECP3-35
328-ball csBGA (10 x 10 mm) 116 / 2
1.0 mm 引脚间距 I/O 数量 / SERDES
  LA-ECP3-17 LA-ECP3-35
256-ball ftBGA (17 x 17 mm) 133 / 4 133 / 4
484-ball fpBGA (23 x 23 mm) 222 / 4 295 / 4
672-ball fpBGA (27 x 27 mm) 310 / 4

解决方案实例

LatticeECP3拥有大量现成的设计关键组成模块,可以直接在您的设计中使用,LatticeECP3不仅仅是全功能的——它已经全副武装。为了帮助您尽可能高效地进行设计,莱迪思一直专注于开发适用于各种应用领域的解决方案,例如:

解决网络边缘的连接问题

  • 构建低成本的以太网与定制或传统接口之间的桥接
  • 快速实现ASSP与无线基站中常见协议之间的桥接,包括CPRI和JESD204
  • 实现网络流量的预处理,通过减少处理器的工作量来提高性能
  • 通过分担DSP功能来增强pico和femto-cell中ASSP的性能

实现高性能的控制面板解决方案,适用于通信、工业、医疗和其他应用

  • 使用串行接口提供与系统其他模块之间的高性能接口
  • 通过优化的预处理算法,减轻控制处理器的工作量

通过超快、大批量并行的工程实现,增强图片/视频系统性能

  • 使用业界领先的功能,提高图像质量
  • 通过成熟的视频分析功能快速解决现实世界的问题
  • 提供与常用的视频协议之间的接口

构建创新的汽车解决方案

  • 实现低成本的串行接口,在整个汽车内部传输图像数据
  • 使用硬件实现,高效地分析图像数据
  • 通过分担显示的缩放、旋转和组合功能,减少处理器的工作量

设计资源

IP和参考设计

使用经过预先测试、可重复使用的功能简化您的设计工作

应用说明

了解如何最高效地使用我们一系列的FPGA和开发板

软件

覆盖整个设计流程,非常易于使用

开发套件和开发板

我们的开发板和开发套件能够简化您的设计流程

编程硬件

使用我们的编程硬件,轻松完成在系统编程和在线重配置

文档

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快速参考
技术资源
资讯资源
下载
标题 编号 版本 日期 格式 文件大小
LA-LatticeECP3 Automotive Family Data Sheet
FPGA-DS-02052 1.2 3/31/2019
LatticeECP3 EA Family Data Sheet
Note: EA devices only.
DS1021 2.8EA 3/24/2015
High-Speed PCB Design Considerations
TN1033 06.1 5/2/2011
Electrical Recommendations for Lattice SERDES
FPGA-TN-02077 3.0 3/30/2018
LatticeECP3 Hardware Checklist
TN1189 2.1 2/13/2012
LatticeECP3 High-Speed I/O Interface
TN1180 2.3 4/2/2013
LatticeECP3 sysCONFIG Usage Guide
TN1169 3.1 6/1/2015
LatticeECP3 and LatticeECP2M High-Speed Backplane Measurements
TN1149 1.5 10/7/2013
LatticeECP3 sysCLOCK PLL/DLL Design and Usage Guide
TN1178 2.6 2/3/2014
LatticeECP3 sysIO Usage Guide
TN1177 2.2 8/19/2013
LatticeECP3 Power Consumption and Management
TN1181 1.1 2/2/2012
LatticeECP3 Marvell SGMII Physical/MAC Layer Interoperability
TN1197 1.1 2/13/2012
LatticeECP3 Marvell XAUI 10 Gbps Physical Layer Interoperability
TN1194 1.1 2/13/2012
LatticeECP3 Slave SPI Port User Guide
FPGA-TN-02136 1.8 8/26/2019
LatticeECP3 SERDES/PCS Usage Guide
TN1176 2.8 8/26/2014
LatticeECP3 sysDSP Usage Guide
TN1182 1.3 2/13/2012
LatticeECP3 and Broadcom 1 GbE (1000BASE-X) Physical/MAC Layer Interoperability
TN1217 1.0 7/26/2010
LatticeECP3 and Marvell 10 Gbps Physical/MAC Layer Interoperability
TN1219 1.0 7/26/2010
LatticeECP3 SERDES/PCS Reset Sequence - Source Code
For use with Technical Note - TN1176
TN1176 1.1 2/4/2010
LatticeECP3 Marvell 1 GbE (1000BASE-X) Physical/MAC Layer Interoperability
TN1196 1.1 2/13/2012
LatticeECP3 Memory Usage Guide
TN1179 1.8 4/1/2014
LatticeECP3 and Broadcom 10 Gbps Physical/MAC Layer Interoperability
TN1218 1.1 2/13/2012
Low-Cost Serial RapidIO to TI 6482 Digital Signal Processor Interoperability with LatticeECP3
TN1214 1.1 10/18/2010
Minimizing System Interruption During Configuration Using TransFR Technology
TN1087 3.7 10/30/2015
Parallel Flash Programming and FPGA Configuration
Also download the implementation files for AN8077.
AN8077 1.3 3/1/2015
Soft Error Detection SED Usage Guide
TN1184 1.7 11/30/2015
Transmission of High-Speed Serial Signals over Common Cable Media
TN1066 01.8 2/13/2012
Parallel Flash Programming and FPGA Configuration - Source Code
For use with Application Note - AN8077
AN8077 1.3 1/4/2013
Advanced Security Encryption Key Programming Guide
TN1215 1.5 1/30/2016
Dual and Mulitple Boot Feature
TN1216 1.6 10/30/2015
LatticeECP3-95EA Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.2 4/15/2010
LatticeECP3-70EA Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.3 4/15/2010
LatticeECP3-70E Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.2 7/13/2009
ECP3 migration 17to70_484
1.2 4/6/2012
ECP3 migration 35to150_672
1.1 7/9/2009
ECP3 migration 70to95_484
1.1 7/9/2009
ECP3 migration 95to150_672
1.2 9/10/2012
ECP3 migration 35to95_484
1.2 9/10/2012
ECP3 migration 35to70_672
1.2 9/10/2012
ECP3 migration 70to150_672
1.2 9/10/2012
LatticeECP3-17EA Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.6 1/24/2012
LatticeECP3-95E Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.2 7/9/2009
LatticeECP3-35EA Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.4 4/15/2010
ECP3 migration 35to95_672
1.2 9/10/2012
ECP3 migration 17to35_484
1.2 4/6/2012
ECP3 migration 70to95_672
1.1 7/9/2009
LatticeECP3-150EA Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.5 4/15/2010
ECP3 migration 17to95_484
1.2 4/6/2012
ECP3 migration 17to35_256
1.2 4/6/2012
ECP3 migration 70to95_1156
1.1 7/9/2009
ECP3 migration 70to150_1156
1.2 9/10/2012
ECP3 migration 35to70_484
1.2 9/10/2012
ECP3 migration 95to150_1156
1.2 9/10/2012
MIPI D-PHY Bandwidth Matrix and Implementation
FPGA-TN-02090 1.2 6/19/2019
Package Diagrams
FPGA-DS-02053 5.8 6/24/2020
Sub-LVDS Signaling Using Lattice Devices
FPGA-TN-02028 1.8 6/24/2020
Reflow Temperature Guidelines and Moisture Sensitivity
FPGA-TN-02041 4.0 6/24/2020
标题 编号 版本 日期 格式 文件大小
LA-LatticeECP3 Automotive Family Data Sheet
FPGA-DS-02052 1.2 3/31/2019
LatticeECP3 EA Family Data Sheet
Note: EA devices only.
DS1021 2.8EA 3/24/2015
标题 编号 版本 日期 格式 文件大小
Electrical Recommendations for Lattice SERDES (Chinese Language Version)
TN1114C 02.8 10/12/2012
High-Speed PCB Design Considerations
TN1033 06.1 5/2/2011
High-Speed PCB Design Considerations (Chinese Language Version)
TN1033C 06.1 5/23/2011
Electrical Recommendations for Lattice SERDES
FPGA-TN-02077 3.0 3/30/2018
LatticeECP3 Hardware Checklist
TN1189 2.1 2/13/2012
LatticeECP3 High-Speed I/O Interface
TN1180 2.3 4/2/2013
LatticeECP3 sysCONFIG Usage Guide
TN1169 3.1 6/1/2015
LatticeECP3 and LatticeECP2M High-Speed Backplane Measurements
TN1149 1.5 10/7/2013
LatticeECP3 sysCLOCK PLL/DLL Design and Usage Guide
TN1178 2.6 2/3/2014
LatticeECP3 sysIO Usage Guide
TN1177 2.2 8/19/2013
LatticeECP3 Power Consumption and Management
TN1181 1.1 2/2/2012
LatticeECP3 Marvell SGMII Physical/MAC Layer Interoperability
TN1197 1.1 2/13/2012
LatticeECP3 SERDES/PCS Usage Guide (Chinese Language Version)
TN1176C 02.4 8/28/2012
LatticeECP3 SERDES/PCS Usage Guide (Japanese Language Version)
TN1176J 2.4 8/22/2012
LatticeECP3 Marvell XAUI 10 Gbps Physical Layer Interoperability
TN1194 1.1 2/13/2012
LatticeECP3 Slave SPI Port User Guide
FPGA-TN-02136 1.8 8/26/2019
LatticeECP3 SERDES/PCS Usage Guide
TN1176 2.8 8/26/2014
LatticeECP3 sysIO Usage Guide (Chinese Language Version)
TN1177C 02.0 6/26/2012
LatticeECP3 sysDSP Usage Guide
TN1182 1.3 2/13/2012
LatticeECP3 and Broadcom 1 GbE (1000BASE-X) Physical/MAC Layer Interoperability
TN1217 1.0 7/26/2010
LatticeECP3 and Marvell 10 Gbps Physical/MAC Layer Interoperability
TN1219 1.0 7/26/2010
LatticeECP3 SERDES/PCS Reset Sequence - Source Code
For use with Technical Note - TN1176
TN1176 1.1 2/4/2010
LatticeECP3 Marvell 1 GbE (1000BASE-X) Physical/MAC Layer Interoperability
TN1196 1.1 2/13/2012
LatticeECP3 Memory Usage Guide
TN1179 1.8 4/1/2014
LatticeECP3 and Broadcom 10 Gbps Physical/MAC Layer Interoperability
TN1218 1.1 2/13/2012
Low-Cost Serial RapidIO to TI 6482 Digital Signal Processor Interoperability with LatticeECP3
TN1214 1.1 10/18/2010
Minimizing System Interruption During Configuration Using TransFR Technology
TN1087 3.7 10/30/2015
Parallel Flash Programming and FPGA Configuration
Also download the implementation files for AN8077.
AN8077 1.3 3/1/2015
Soft Error Detection SED Usage Guide
TN1184 1.7 11/30/2015
Transmission of High-Speed Serial Signals over Common Cable Media
TN1066 01.8 2/13/2012
Parallel Flash Programming and FPGA Configuration - Source Code
For use with Application Note - AN8077
AN8077 1.3 1/4/2013
Advanced Security Encryption Key Programming Guide
TN1215 1.5 1/30/2016
Dual and Mulitple Boot Feature
TN1216 1.6 10/30/2015
MIPI D-PHY Bandwidth Matrix and Implementation
FPGA-TN-02090 1.2 6/19/2019
Sub-LVDS Signaling Using Lattice Devices
FPGA-TN-02028 1.8 6/24/2020
Reflow Temperature Guidelines and Moisture Sensitivity
FPGA-TN-02041 4.0 6/24/2020
标题 编号 版本 日期 格式 文件大小
LatticeECP3-95EA Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.2 4/15/2010
LatticeECP3-70EA Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.3 4/15/2010
LatticeECP3-70E Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.2 7/13/2009
ECP3 migration 17to70_484
1.2 4/6/2012
ECP3 migration 35to150_672
1.1 7/9/2009
ECP3 migration 70to95_484
1.1 7/9/2009
ECP3 migration 95to150_672
1.2 9/10/2012
ECP3 migration 35to95_484
1.2 9/10/2012
ECP3 migration 35to70_672
1.2 9/10/2012
ECP3 migration 70to150_672
1.2 9/10/2012
LatticeECP3-17EA Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.6 1/24/2012
LatticeECP3-95E Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.2 7/9/2009
LatticeECP3-35EA Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.4 4/15/2010
ECP3 migration 35to95_672
1.2 9/10/2012
ECP3 migration 17to35_484
1.2 4/6/2012
ECP3 migration 70to95_672
1.1 7/9/2009
LatticeECP3-150EA Pinout
Note: a pin out file can be exported from Diamond version 1.3 or above.
1.5 4/15/2010
ECP3 migration 17to95_484
1.2 4/6/2012
ECP3 migration 17to35_256
1.2 4/6/2012
ECP3 migration 70to95_1156
1.1 7/9/2009
ECP3 migration 70to150_1156
1.2 9/10/2012
ECP3 migration 35to70_484
1.2 9/10/2012
ECP3 migration 95to150_1156
1.2 9/10/2012
Package Diagrams
FPGA-DS-02053 5.8 6/24/2020
标题 编号 版本 日期 格式 文件大小
DDR2 Demo for the LatticeECP3 Serial Protocol Board
Describes the DDR2 Demo for use with the LatticeECP3 Serial Protocol Board.
UG49 5/22/2013
LatticeECP3 DDR3 Demo for the LatticeECP3 I/O Protocol Board User's Guide
UG38 01.4 6/8/2012
LatticeECP3 CPRI Demo Design User's Guide
UG26 01.2 5/3/2012
JESD207 IP Core User's Guide
IPUG111 1.0 8/27/2013
LatticeECP3 PCI Express Root Complex Lite x1 Native Demo
UG40 1.0 10/29/2010
LatticeECP3 Eye/Backplane Demo for the LatticeECP3 Serial I/O Protocol Board User's Guide
UG24 01.4 3/4/2011
LatticeECP3 Video Protocol Board - Revision B User's Guide
EB39 1.3 3/2/2010
LatticeECP3 AMC Serial RapidIO 2.1 Demo User's Guide
UG39 01.0 11/17/2010
LatticeECP3 XAUI Demo
UG23 01.3 6/16/2011
LatticeECP3 Serial Protocol Board - Revision D User's Guide
EB44 1.3 7/8/2010
LatticeECP3 AMC Evaluation Board User's Guide
EB56 01.1 8/27/2012
PCIe Sample Demo Debugging and Packet Analysis Guide
TN1271 10/13/2013
PCI IP Core User's Guide
PCI Core User Guide for LatticeSC, LatticeECP3, LatticeECP2/M, LatticeECP/EC, LatticeXP, Mach XO, and MachXO2
IPUG18 9.2 11/8/2010
RapidIO 2.x LP-Serial Physical Layer Endpoint IP Core User's Guide
IPUG84 01.3 6/28/2011
Tri-Rate SDI PHY IP Loopback and Passthrough Sample Designs
UG22 1.1 10/30/2009
Tri-Rate SMPTE SDI Demo
UG21 01.5 12/21/2011
标题 编号 版本 日期 格式 文件大小
WISHBONE UART - Source Code
RD1042 1.6 12/1/2014 ZIP 58.5 MB
Parallel to MIPI DSI TX Bridge - Source Code
RD1184 1.5 1/1/2015
Parallel to MIPI CSI-2 TX Bridge - Source Code
RD1183 1.5 1/1/2015
MIPI CSI2-to-CMOS Parallel Sensor Bridge - Documentation
RD1146 1.5 12/26/2016
MIPI CSI-2-to-CMOS Parallel Sensor Bridge
RD1146 1.4 12/28/2016
MDIO (Management Data Input/Output Interface) Peripheral - WISHBONE Compatible
RD1074 1.1 4/1/2011
Parallel to MIPI DSI TX Bridge - Documentation
RD1184 1.5 1/1/2015
PCI Target 32-bit/33MHz
RD1008 3.5 8/19/2013
Parallel to MIPI CSI-2 TX Bridge - Documentation
RD1183 1.5 1/1/2015
RGMII to GMII Bridge Reference Design
Also download the source code below
RD1022 2.3 11/18/2016
RGMII to GMII Bridge - Source Code
RD1022 2.3 11/18/2016
PCI/WISHBONE Bridge
RD1045 1.3 4/10/2011
WISHBONE UART - Documentation
RD1042 1.6 12/1/2014
标题 编号 版本 日期 格式 文件大小
Courtesy Notification of Additional Ejector Pin Sites on Select BGA Packages
5/22/2013
PCN 09A-12 Customer Characterization Report
PCN09A-12 1.0 5/14/2012
PCN 09A-12 Affected Devices
Assembly Site
PCN09A-12 1.0 5/14/2012
PCN 09A-12 Alternate Qualified Material Set, Assembly Site for Select Lattice Families
PCN09A-12 1.0 5/14/2012
PCN 09A-12 Material Set Changes
Assembly Site
PCN09A-12 1.0 5/14/2012
PCN 09A-12 Frequently Asked Questions
PCN09A-12 1.0 5/11/2012
PCN05A-11 Notification of Intent to Utilize an Alternate Foundry Process for LatticeECP3
Process
PCN05A-11 1.0 4/11/2011
PCN10A-11 Notification of Intent to Freeze ispLEVER After Version 8.2
Conversion
PCN10A-11 1.0 7/25/2011
ACN03D-11 Withdrawal of ACN03C-11
Material Set
ANC03D-11 1 4/1/2011
PCN07C-11 Withdrawal of PCN07B-11
Material Set
PCN07C-11 1.0 8/1/2011
PCN11A-10 Notification of Change of Ordering Part Number for the LFE3-70E and LFE3-95E to the LFE3-70EA and LFE3-95EA, Respectively
PCN11A-10 1 7/9/2010
PCN11A-10 Notification of Change of Ordering Part Number for the LFE3-70E and LFE3-95E to the LFE3-70EA and LFE3-95EA, Respectively - Japanese Language
PCN11A-10 1 7/9/2010
PCN03A-13 Device Characterization Report
PCN03A-13 6/28/2013
PCN 03B13 Alternate Qualified Assembly Test Site Alternate Qualified Material Sets ASE Taiwan
Assembly Site, Material Set
PCN03B 1.0 11/14/2014
PCN03A-13 FAQs
PCN03A-13 6/28/2013
PCN03B-13 Affected Part Number and Material Sets
PCN03B-13 6/28/2013
PCN08A13_AffectedDevices
Other
PCN08A-13 1 9/26/2013
PCN03A-13 Alternate Qualified Assembly and Material Sets for Select Devices
PCN03A-13 6/28/2013
PCN03A-14 Characterization Report
PCN03A-14 1.0 4/4/2014
PCN06A-14 Affected Device List
PCN06A-14 1.0 10/3/2014
PCN06A-14 Material Set Table
PCN06A-14 1.0 10/3/2014
PCN06A-14 Characterization Report
PCN06A-14 1.0 10/3/2014
PCN06B-14 Notification of Intent to Utilize an Alternate Qualified Assembly Site/Test Site and Alternate Qualified Material Sets for Select Lattice Products
PCN06B-14 1.0 11/21/2014
PCN03A-14 FAQ
PCN03A-14 1.0 4/4/2014
PCN03A-14 Material Set Table
PCN03A-14 1.0 4/4/2014
PCN03A-14 Affected Part Number List
PCN03A-14 1.0 4/4/2014
PCN03B-14 Notification of Intent to Utilize an Alternate Qualified Assembly Site/Test Site and/or Alternate Qualified Material Sets for Select Lattice Products
PCN03B-14 1.0 11/21/2014
PCN 02A-16 ECP5/ECP5-5G updates on Diamond v3.7
PCN02A-16 1.0 3/1/2016
PCN05A-17 Halogen-Free substrate at ASEM
1.2 10/27/2017
PCN05A-17 Affected Parts List
1.0 1/1/0001
标题 编号 版本 日期 格式 文件大小
Lattice OrCAD Capture Schematic Library (OLB)
This file contains an OrCAD Capture Schematic Library (OLB file type) for all Lattice products. This .zip file also includes a .xls worksheet with a list of the contents of the OLB. These symbols can be used to help with OrCAD schematic designs.
6.7 6/24/2020
标题 编号 版本 日期 格式 文件大小
SERCOS III Evaluation Kit Product Brief
I0223 1.0 2/24/2012
Wireless Solutions Brochure
I0197 3.0 8/14/2012
New LatticeECP3 Devices - News Brief
NB106 1.0 1/23/2012
LatticeECP3 Product Brief (Chinese)
I0198C 7.0 5/29/2012
LatticeECP3 Family Product Brochure
I0198 8.0 5/29/2012
Lattice HetNet Solutions Brochure
I0234 1.0 11/12/2013
Automotive Solutions Product Brief
I0164 8.0 7/2/2013
LatticeECP3 Versa Development Kit - News Brief
NB103 2.0 7/5/2012
Ethernet Solutions Brochure
I0194 2.0 12/16/2009
LatticeECP3: First PCIe 2.0 Compliant Low Cost FPGA - News Brief
NB104 7/1/2011
IP Suites for LatticeECP3 - News Brief
NB101 2/4/2011
Automotive Solutions Product Brief (Chinese)
I0164hc 8.0 8/7/2013
Product Selector Guide
I0211 26.0 7/9/2020
标题 编号 版本 日期 格式 文件大小
MG328_LAE3
Rev O 1/30/2020
MG328_FE3
Rev Q 1/30/2020
FN672
Rev K 6/29/2020
FN484
Rev J 6/26/2020
FN484_LAE3
Rev F 6/26/2020
FN672_LAE3
Rev G 6/29/2020
FTN256_v2_FE3
Rev P 6/22/2020
FN1156_FE3
Rev J 7/7/2020
标题 编号 版本 日期 格式 文件大小
LatticeECP3 PCI Express Development Kit Installation Read Me - Windows
3/9/2011
LatticeECP3 PCI Express Development Kit Installation Read Me - Linux
3/9/2011
标题 编号 版本 日期 格式 文件大小
Gen2 Serial RapidIO and Low Cost Low Power FPGAs (Korean Language)
1.0 9/26/2011
FPGAs in Next Generation Wireless Networks (Korean Language)
1/1/0001
FPGAs in Next Generation Wireless Networks (LatticeECP3)
1.0 3/10/2010
Embedded Signal Processing Capabilities of the LatticeECP3 sysDSP Block
1.0 2/19/2009
FPGAs in Next Generation Wireless Networks (Chinese Language)
1/1/0001
Embedded Display Control Using FPGAs (Chinese Language)
1.0 6/28/2010
GEN2 Serial RapidIO and Low Cost, Low Power FPGAs - Chinese Language
1.0 5/22/2013
Designing for Low Power (LatticeECP3)
1.0 3/10/2010
FPGAs in Next Generation Wireless Networks (Japanese Language)
1.0 3/10/2010
FPGAs in Next Generation Wireless Networks (Traditional Chinese Language)
1.0 1/1/0001
Expanding Microprocessor Connectivity Using Low-cost FPGAs (Chinese)
1.0 8/28/2013
GEN2 Serial RapidIO and Low Cost, Low Power FPGAs
1.0 8/4/2011
Power Considerations in FPGA Design (Chinese Language)
1.0 6/8/2009
Power WP - Design Example Source Code (LatticeECP3)
1.0 2/17/2009
Power Considerations in FPGA Design (LatticeECP3)
1.0 2/19/2009
Embedded Signal Processing Capabilities of the LatticeECP3 sysDSP Block (Chinese Language)
1.0 6/8/2009
Implementing DDR3 Memory Controller (LatticeECP3)
1.0 3/10/2010
High-Speed SERDES Interfaces In High Value FPGAs (LatticeECP3)
1.0 2/19/2009
在嵌入式设计中采用基于D-PHY的MIPI标准外设
1.0 5/1/2014
Implementing PCI Express Bridging Solutions in an FPGA (Chinese Language)
1.0 7/1/2010
Implementing PCI Express Bridging Solutions in an FPGA
1.0 7/1/2010
标题 编号 版本 日期 格式 文件大小
[BSDL] LFE3-17EA CSBGA328
1.01 2/14/2014
[BSDL] LFE3-35EA FPBGA256
1.01 9/10/2012
[BSDL] LFE3-70E FPBGA672
1.02 9/10/2012
[BSDL] LFE3-95EA FPBGA484
1.01 9/10/2012
[BSDL] LFE3-95E FPBGA484
1.03 9/10/2012
[BSDL] LFE3-95E FPBGA1156
1.02 9/10/2012
[BSDL] LFE3-35EA FPBGA484
1.02 2/7/2014
[BSDL] LFE3-70EA FPBGA1156
1.01 9/10/2012
[BSDL] LFE3-95E FPBGA672
1.03 9/10/2012
[BSDL] LFE3-70E FPBGA484
1.02 9/10/2012
[BSDL] LFE3-70EA FPBGA672
1.01 9/10/2012
[BSDL] LFE3-150EA FPBGA1156
1.01 9/10/2012
[BSDL] LFE3-70E FPBGA1156
1.03 9/10/2012
[BSDL] LFE3-17EA FPBGA256
1.02 2/14/2014
[BSDL] LFE3-70EA FPBGA484
1.01 9/10/2012
[BSDL] LFE3-95EA FPBGA1156
1.01 9/10/2012
[BSDL] LFE3-95EA FPBGA672
1.01 9/10/2012
[BSDL] LFE3-35EA FPBGA672
1.01 9/10/2012
[BSDL] LFE3-17EA FPBGA484
1.02 2/12/2014
[BSDL] LFE3-150EA FPBGA672
1.01 9/10/2012
标题 编号 版本 日期 格式 文件大小
ECP3 Device Family DELPHI Models
1.0 3/20/2009
标题 编号 版本 日期 格式 文件大小
[IBIS] Lattice ECP3
2.2 9/10/2012 IBS 64.3 MB
标题 编号 版本 日期 格式 文件大小
LatticeECP3 Versa Kit - SerDes Eye Backplane Demo - Design Files for Windows
Demonstrates the SERDES performance of the LatticeECP3 FPGA at 3.125Gbps using the LatticeECP3 Versa board, along with Lattice software. Installation includes documentation and source files.
1.0 1/1/0001
LatticeECP3 Versa Kit - SerDes Eye Backplane Demo - Design Files for Linux
Demonstrates the SERDES performance of the LatticeECP3 FPGA at 3.125Gbps using the LatticeECP3 Versa board, along with Lattice software. Installation includes documentation and source files.
01.0 1/1/0001
标题 编号 版本 日期 格式 文件大小
ECP3 PCI Express Development Kit Demos (Windows)
5/22/2013 EXE 48.5 MB
ECP3 PCI Express Development Kit Demos (Linux)
5/22/2013 GZ 56.2 MB
Tri-Rate SMPTE SDI Demo
For use with ispLEVER 7.2 SP2
1.0 4/30/2009
Tri-Rate SMPTE SDI Demo
For use with ispLEVER 8.1 SP1
2.0 4/24/2014
DDR2 Demo for the LatticeECP3 Serial Protocol Board - demo files
Demo source files for the DDR2 Demo, for use with the LatticeECP3 Serial Protocol Board
5/22/2013
LatticeECP3 PCI Express Root Complex Lite x1 Native Demo
1.0 11/1/2010
LatticeECP3 DDR3 Demo
1.4 6/8/2012
LatticeECP3 XAUI Demo
1.3 6/16/2011