莱迪思博客

Q2 2019 Industrial and Automotive Newsletter

莱迪思工业和汽车市场新闻速递

Posted 06/28/2019 by Lattice Semiconductor

了解莱迪思汽车和工业领域的新闻:全新FPGA通过硬件可信根保障固件安全、CrossLink桥接方案连接移动处理器、全新3D测绘演示、适用于ECP5的全新缩放器 IP、莱迪思Diamond软件v 3.11版本新增支持MachXO3D FPGA。

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