Lattice provides several printed circuit board (PCB) layout examples using fine-pitch (0.4 mm and 0.5 mm ball-to-ball center) ball grid array (BGA) packages to assist design and layout. In many cases alternative implementations are provided to illustrate ways to reduce fabrication cost. The design of a BGA "breakout" consists of fanout and escape traces to the perimeter of the BGA device prior to general routing of the PCB. For fabrication design rule details and screenshots of the computer aid manufacturing (CAM) photoplot artwork of each circuit board see the examples below.
The PCB computer aided design (CAD) breakout and routing examples present various fine pitch packages of Lattice PLDs. Each ZIP archive download includes a PCB layout design in a Mentor Graphics PADS Layout compatible format ASCII (.asc) or PADS Layout (.pcb), NCDrill list, and CAM artwork. Each package example is built to comply with IPC7351 www.ipc.org specifications and nomenclature conventions. All PADS Layout boards are designed using millimeter units. CAM/Gerber output are in 1/1000th inch, mil (3.5 format) units. Some examples include different layout options depending on design and cost goals. For example, the 256-ball chip array BGA (BN256) examples demonstrate a design with fully utilized I/Os, fine trace width and pitch, on a 6-layer layer PCB stack up and a less expensive design with relaxed design rules, and fewer I/O pads routed, on a 4-layer PCB stack up.
| Family | Package/Download | Pitch (mm) | Signal/ Power Layers |
Trace/ Width Space (mm) |
Ball Pad (mm) | Ball Mask (mm) | Escape Via Pad (mm) | Escape Via Drill (mm) |
|---|---|---|---|---|---|---|---|---|
| ispMACH 4000ZE | 64-ball csBGA | 0.5 | 6 | 0.10/0.10 | 0.23 | 0.33 | 0.30 | 0.125 |
| 64-ball ucBGA | 0.4 | 6 | 0.10/0.10 | 0.18 | 0.28 | 0.25/0.40 | 0.10/0.15 | |
| 144-ball csBGA #1 | 0.5 | 6 | 0.10/0.10 | 0.23 | 0.33 | 0.30 | 0.125 | |
| 144-ball csBGA #2 | 0.5 | 4 | 0.10/0.10 | 0.23 | 0.38 | 0.30 | 0.125 | |
| MachXO | 100-ball csBGA #1 | 0.5 | 4 | 0.085/0.085 | 0.23 | 0.38 | 0.45 | 0.20 |
| 100-ball csBGA #2 | 0.5 | 4 | 0.10/0.10 | 0.23 | 0.38 | 0.45 | 0.20 | |
| 132-ball csBGA #1 | 0.5 | 4 | 0.085/0.085 | 0.23 | 0.38 | 0.40 | 0.15 | |
| 132-ball csBGA #2 | 0.5 | 4 | 0.10/0.10 | 0.23 | 0.38 | 0.40 | 0.15 | |
| 256-ball caBGA #1 | 0.8 | 6 | 0.10/0.10 | 0.35 | 0.50 | 0.40 | 0.125 | |
| 256-ball caBGA #2 | 0.8 | 4 | 0.10/0.10 | 0.35 | 0.50 | 0.40/0.45 | 0.125/0.2 | |
| MachXO2 | 64-ball ucBGA | 0.8 | 4 | 0.075/0.075 | 0.17 | 0.27 | 0.30 | 0.10 |
| 132-ball csBGA | 0.5 | 4 | 0.085/0.085 | 0.23 | 0.33 | 0.40 | 0.13 | |
| 256-ball caBGA | 0.8 | 4 | 0.10/0.10 | 0.35 | 0.50 | 0.40 | 0.13 | |
| 256-ball ftBGA | 1.0 | 4 | 0.10/0.10 | 0.40 | 0.50 | 0.45 | 0.15 | |
| 332-ball caBGA | 0.8 | 4 | 0.08/0.08 | 0.35 | 0.45 | 0.45 | 0.15 | |
| 484-ball fpBGA | 1.0 | 4 | 0.10/0.10 | 0.40 | 0.50 | 0.45 | 0.13 |
For mechanical dimension details on packages, see the Lattice Semiconductor Package Diagrams, Data Sheet Package Diagrams.
The following EDA software tools are recommended for viewing the PCB CAD source files.
© Lattice Semiconductor Corporation 2013
