100-ball csBGA Breakout and Routing Examples

These examples place a MachXO PLD in a 8x8 mm, 0.5 mm pitch, 100-ball csBGA package (LCMXO640-M100/MN100) into two fabrication scenarios. One for a 4-layer stack up with 100% I/O utilization and a second that uses some cost-cutting measures like relaxed trace width/space dimensions and 15% fewer I/Os.

Note: Example designs are not intended to be used for any particular application. Before applying any technique, confirm that your PCB fabrication service will support the dimensions specified.

Download Example #1

 

Download Example #2

 

100-ball csBGA (MN100) Example #1

Stackup and Drill Pairs

 

Design Rules Example #1

Specification	mm	mils
Trace Width/Space	0.085/0.085	3/3
Ball Pad	0.23	9
Ball Mask	0.38	15
Escape Via Pad	0.45	18
Escape Via Drill	0.20	8
Escape Via Mask	0.60	24
Plane Antipad Space	0.55	22
Thermal Relief	0.65	26

Fabrication Notes

• NSMD (Non Solder Mask Defined) pads
• 3.3 mil escape traces

 

CAM Artwork Screenshots Example #1

Layer 1 Primary	Layer 2 GND
Layer 3 Power	Layer 4 Secondary

100-ball csBGA (MN100) Example #2

Stackup and Drill Pairs

 

Design Rules Example #2

Specification	mm	mils
Trace Width/Space	0.10/0.10	4/4
Ball Pad	0.23	9
Ball Mask	0.38	15
Escape Via Pad	0.45	18
Escape Via Drill	0.20	8
Escape Via Mask	0.60	24
Plane Antipad Space	0.55	22
Thermal Relief	0.65	26

Fabrication Notes

• NSMD (Non Solder Mask Defined) pads

 

CAM Artwork Screenshots Example #2

Layer 1 Primary	Layer 2 GND
Layer 3 Power	Layer 4 Secondary