Lattice Semiconductor revolutionized the PLD industry with the development of ISP™, and is now doing it again by offering the most technologically advanced packaging options available. Ball Grid Array (BGA) packages present numerous benefits previously unobtainable in a single packaging technology. BGAs provide higher pin counts in less area and a robust "ball" structure that integrates seamlessly into the manufacturing process.
Lattice Semiconductor offers the largest, most diverse offering of advanced BGA packages available today. A wide variety of ball-counts and pitches, including 1.00mm BGAs, and space-saving 0.5mm pitch Chip Scale BGA, and 0.4mm pitch Ultra Chip Scale and Wafer Level Chip Scale BGA packages are now available.
Download Lattice packaging diagrams| Package | Available Devices |
|---|---|
| 25 ball Wafer Level Chip Scale | LCMXO2-1200ZE |
| 56 ball Chip Scale BGA | ispMACH 4032Z, ispMACH 4064Z |
| 64 ball Ultra Chip Scale BGA | LCMXO2-256, ispMACH 4064ZE |
| 64 ball Chip Scale BGA | ispMACH 4032ZE, ispMACH 4064ZE |
| 100 ball fpBGA | ispGDX2 64V, ispGDX2E 64V |
| 132 ball Ultra Chip Scale BGA | ispMACH 4128ZE |
| 132 ball Chip Scale BGA | LCMXO2-256, LCMXO2-640, LCMXO2-1200, LCMXO2-2000, LCMXO2-4000,LFXP2-5, LFXP2-8, ispMACH 4064Z, ispMACH 4128Z, ispMACH 4256Z, LCMXO640, LCMXO1200, LCMXO2280 |
| 144 ball Chip Scale BGA | ispMACH 4064ZE, ispMACH 4128ZE, ispMACH 4256ZE |
| 184-ball csBGA | XO2-4000HE |
| 208 ball fpBGA | ispGDX2 128V, ispGDX2E 128V |
| 208 ball ftBGA | LPTM10-12107 |
| 256 ball fpBGA | ECP2-6, ECP2-12, ECP2-20, ECP2M-20, LFEC3, LFEC6, LFEC10, LFEC15, LFECP6, LFECP10, LFECP15, LFX125EB, LFX200B, LFX200EB, ispXPLD 5256MV, ispXPLD 5256MB, ispXPLD 5512MV, ispXPLD 5512MB, ispXPLD 5768MV, M4A5-256, LFXP6, LFXP10, LFXP15, LFXP20 |
| 256 ball ftBGA | LCMXO2-1200U, LCMXO2-2000, LCMXO2-4000, LCMXO2-7000, LFE3-17, LFE3-35, LFXP2-5, LFXP2-8, LFXP2-17, LFXP2-30, LCMXO640, LCMXO1200, LCMXO2280, ispMACH 4256V, ispMACH 4256B, ispMACH 4256C, ispMACH 4384V, ispMACH 4384B, ispMACH 4384C, ispMACH 4512V, ispMACH 4512B, ispMACH 4512C |
| 256 ball caBGA | LCMXO2-2000, LCMXO2-4000, LCMXO2-7000 |
| 324 ball ftBGA | LCMXO2280 |
| 332 ball caBGA | LCMXO2-4000, LCMXO2-7000 |
| 328 ball csBGA | ECP3-17EA |
| 388 ball fpBGA | LFXP10, LFXP15, LFXP20 |
| 484 ball fpBGA | LCMXO2-2000U, LCMXO2-4000, LCMXO2-7000, LFE3-17, LFE3-35, LFE3-70, LFE3-95, LFXP2-17, LFXP2-30, LFXP2-40, ECP2-12, ECP2-20, ECP2-35, ECP2-50, ECP2M-20, ECP2M-35, ECP2M-50, LFEC6, LFEC10, LFEC15, LFEC20, LFECP6, LFECP10, LFECP15, LFECP20, LC51024VG, ispXPLD 5512MV, ispXPLD 5768MV, ispXPLD 51024MV, ispGDX2 256V, ispGDX2E 256V, ORT42G5, ORSO42G5, LFXP15, LFXP20 |
| 672 ball fpBGA | LFE3-35, LFE3-70, LFE3-95, LFE3-150, LFXP2-30, LFXP2-40, ECP2-20, ECP2-35, ECP2-50, ECP2-70, ECP2M-35, ECP2M-50, LFEC20, LFEC40, LFECP20, LFECP40, ispXPLD 51024MV |
| 680 ball fpBGA | ORT82G5, ORSO82G5, ORT8850H/L |
| 900 ball fpBGA | ECP2-70, ECP2M-50, ECP2M-70, ECP2M-100, LFEC40, LFECP40 |
| 1020 ball fcBGA | LFSC/SCM25, LFSC/SCM40 |
| 1152 ball fpBGA | ECP2M-70, ECP2M-100 |
| 1152 ball fcBGA | LFSC/SCM40, LFSC/SCM80, LFSC/SCM115 |
| 1156 ball fpBGA | LFE3-70, LFE3-95, LFE3-150 |
| 1704 ball fcBGA | LFSC/SCM80, LFSC/SCM115 |
© Lattice Semiconductor Corporation 2013
