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Ball Grid Array (BGA) Packaging

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Lattice Semiconductor revolutionized the PLD industry with the development of ISP™, and is now doing it again by offering the most technologically advanced packaging options available. Ball Grid Array (BGA) packages present numerous benefits previously unobtainable in a single packaging technology. BGAs provide higher pin counts in less area and a robust "ball" structure that integrates seamlessly into the manufacturing process.

Lattice Semiconductor offers the largest, most diverse offering of advanced BGA packages available today. A wide variety of ball-counts and pitches, including 1.00mm BGAs, and space-saving 0.5mm pitch Chip Scale BGA packages are now available.

Download Lattice packaging diagrams

 

BGA Package Selector Guide
Package Available Devices
56 ball Chip Scale BGA ispMACH 4032Z, ispMACH 4064Z
64 ball Chip Scale BGA ispMACH 4032ZE, ispMACH 4064ZE
100 ball fpBGA ispGDX2 64V/B/C, ispGDX2E 64V/B/C
132 ball Chip Scale BGA LFXP2-5, LFXP2-8, ispMACH 4064Z, ispMACH 4128Z, ispMACH 4256Z, LCMXO640, LCMXO1200, LCMXO2280
144 ball Chip Scale BGA
 ispMACH 4064ZE, ispMACH 4128ZE, ispMACH 4256ZE
208 ball fpBGA ispGDX2 128V/B/C, ispGDX2E 128V/B/C
256 ball fpBGA ECP2-6, ECP2-12, ECP2-20, ECP2M-20, LFEC3, LFEC6, LFEC10, LFEC15, LFECP6, LFECP10, LFECP15, LFX125B, LFX125EB, LFX125C, LFX125EC, LFX200B, LFX200EB, LFX200C, LFX200EC, ispXPLD 5256MV, ispXPLD 5256MB, ispXPLD 5256MC, ispXPLD 5512MV, ispXPLD 5512MB, ispXPLD 5512MC, ispXPLD 5768MV, ispXPLD 5768MB, ispXPLD 5768MC, ispMACH 4256V, ispMACH 4256B, ispMACH 4256C, ispMACH 4384V, ispMACH 4384B, ispMACH 4384C, ispMACH 4512V, ispMACH 4512B, ispMACH 4512C, M4A5-256, LFXP6, LFXP10, LFXP15, LFXP20
256 ball ftBGA LFXP2-5, LFXP2-8, LFXP2-17, LFXP2-30, LCMXO640, LCMXO1200, LCMXO2280
324 ball ftBGA LCMXO2280
388 ball fpBGA LFXP10, LFXP15, LFXP20
484 ball fpBGA LFXP2-17, LFXP2-30, LFXP2-40, ECP2-12, ECP2-20, ECP2-35, ECP2-50, ECP2M-20, ECP2M-35, ECP2M-50, LFEC6, LFEC10, LFEC15, LFEC20, LFECP6, LFECP10, LFECP15, LFECP20, LC51024VG, ispXPLD 5512MV, ispXPLD 5512MB, ispXPLD 5512MC, ispXPLD 5768MV, ispXPLD 5768MB, ispXPLD 5768MC, ispXPLD 51024MV, ispXPLD 51024MB, ispXPLD 51024MC, ispGDX2 256V/B/C, ispGDX2E 256V/B/C, ORT42G5, ORSO42G5, LFXP15, LFXP20
516 ball fpBGA LFX125B, LFX125EB, LFX125C, LFX125EC, LFX200B, LFX200EB, LFX200C, LFX200EC, LFX500B, LFX500EB, LFX500C LFX500EC
672 ball fpBGA LFXP2-30, LFXP2-40, ECP2-20, ECP2-35, ECP2-50, ECP2-70, ECP2M-35, ECP2M-50, LFEC20, LFEC40, LFECP20, LFECP40, ispXPLD 51024MV, ispXPLD 51024MB, ispXPLD 51024MC
680 ball fpBGA LFX1200B, LFX1200EB, LFX1200C, LFX1200EC, ORT82G5, ORSO82G5, ORT8850H/L, ORLI10G
900 ball fpBGA ECP2-70, ECP2M-50, ECP2M-70, ECP2M-100, LFEC40, LFECP40, LFX500B, LFX500EB, LFX500C, LFX500EC, LFX1200B, LFX1200EB, LFX1200C LFX1200EC
1020 ball fcBGA LFSC/SCM25, LFSC/SCM40
1036 ball ftSBGA ORSPI4
1152 ball fpBGA ECP2M-70, ECP2M-100
1152 ball fcBGA LFSC/SCM40, LFSC/SCM80, LFSC/SCM115
1156 ball fpBGA ORSPI4
1704 ball fcBGA LFSC/SCM80, LFSC/SCM115

Features

  • Large Selection of BGA Packages - Including 56, 64, 100, 132, 144, 208, 256, 324, 388, 484, 516, 672, 680, 900, 1020, 1036, 1152, 1156, and 1704 balls
  • Reduced Package Size and Height - Up to 90% area savings on printed circuit board space