Overview
The RapidIO Interconnect Architecture is an industry-standard, packet-based interconnect technology that provides a reliable, high-performance interconnect between NPUs (network processing units), CPUs (central processing units), and DSPs (digital signal processors). Serial RapidIO enables chip-to-chip, board-to-board, and system-to-system communications and is targeted at the networking, embedded, and storage markets.
The core is architected for performance and optimal resource utilization of the LatticeECP2M architecture, consuming between only 50-70% of the smallest device, depending on the features implemented. As a result, the solution enables significant device resources for customer applications such as bridging to data plane or control plane interfaces. such as CPRI or PCI Express respectively. When combined with LatticeECP2M device features such as small scale packaging, low power consumption, and high-speed SERDES resources, the Praesum solution offers compelling value for multiple markets including digital signal processing, embedded computing, military/aerospace, and communications infrastructure. ![]() Praesum Serial RapidIO 1x Physical Layer Core Block Diagram Implementation ResultsThe following are typical performance and utilization results.
1 Performance and utilization characteristics are generated using an LFE2M-20E-6F256C. When using this IP core in a different density, package, speed, or grade within the LatticeECP2M family, performance and utilization may vary. Features
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