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LatticeECP2/M Low-Cost FPGA

In Detail

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Key Features

4 to 16 SERDES - 3.125Gbps (ECP2M only)
- Only 100mW power per channel
- Supports PCIexpress, Ethernet, & other packet protocols
Lowest Power SERDES-based FPGA
- 95K LUTs with under 0.35W static power
Optimized FPGA Architecture for Low Cost Applications
- Up to 5.3Mbit Block and Distributed RAM
- Up to 95K LUTs
- Up to 601 I/O

DSP Blocks
- With multiply, addition, subtract and accumulate
Pre-Engineered Source Synchronous I/O
- Supports up to 840Mbps LVDS I/O, DDR1/2 at 533Mbps , and SPI4.2 at 750Mbps
Superior Configuration Options
- Encrypted bitstream and dual boot support
- TransFR technology for easy field upgrades
LatticeECP2/M Family Handbook(PDF, 8M)

LatticeECP2 Standard Evaluation Board
- To quickly evaluate the LatticeECP2 FPGA on a ready-made platform.
LatticeECP2 Advanced Evaluation Board
- Features more advanced interfaces for system-level evaluation and development.
LatticeECP2M PCI Express Development Kit
- This kit includes a board featuring the LatticeECP2M50 with both PCIe x1 and PCIe x4 edges. The kit also includes extensive documentation, drivers, software and demonstrations to help launch your PCI Express design.

Partner Solution

LatticeECP2M PCI Express x4 Evaluation Board
- Provides a plug in card that can be used to evaluate the LatticeECP2M-50 (or LatticeECP2M-35) in PCI Express and generic SERDES applications.
LatticeECP2M SERDES Evaluation Board
- To evaluate the SERDES I/O of the LatticeECP2M-50 (or LatticeECP2M-35), interface to PCI Express x1, connect to SERDES via SFP or SATA, or for general SERDES applications.
LatticeECP2M SMPTE SDI Evaluation Board
- Part of a complete solution designed to demonstrate the integration of HD-SDI, SDI - SMPTE 259 and 292 - and DVB-ASI encoders and decoders into an FPGA.

LatticeECP2(including "S-Series") Selection Guide
Device	ECP2-6	ECP2-12	ECP2-20	ECP2-35	ECP2-50	ECP2-70
LUTs (K)	6	12	21	32	48	68
Distributed RAM (Kbits)	12	24	42	64	96	136
EBR SRAM (Kbits)	55	221	276	332	387	1032
EBR SRAM Blocks	3	12	15	18	21	56
sysDSP Blocks	3	6	7	8	18	22
18x18 Multipliers	12	24	28	32	72	88
DLL + PLL	2+2	2+2	2+2	2+2	2+4	2+6
Maximum Available I/O	190	297	402	450	500	583
Packages	I/O Count
144-pin TQFP (20 x 20 mm)	90	93
208-pin PQFP (28 x 28 mm)		131	131
256-ball fpBGA (17 x 17 mm)	190	193	193
484-ball fpBGA (23 x 23 mm)		297	331	331	339
672-ball fpBGA (27 x 27 mm)			402	450	500	500
900-ball fpBGA (31 x 31 mm)						583

LatticeECP2M(including "S-Series") Selection Guide
Device	ECP2M-20	ECP2M-35	ECP2M-50	ECP2M-70	ECP2M-100
LUTs (K)	19	34	48	67	95
sysMEM Blocks (18kb)	66	114	225	246	288
Embedded Memory (Kbits)	1217	2101	4147	4534	5308
Distributed Memory (Kbits)	41	71	101	145	202
sysDSP Blocks	6	8	22	24	42
18x18 Multipliers	24	32	88	96	168
GPLL + SPLL + DLL	2+6+2	2+6+2	2+6+2	2+6+2	2+6+2
Maximum Available I/O	304	410	410	436	520
Packages	SERDES I/O Combinations
256-ball fpBGA (17 x 17 mm)	4/140	4/140
484-ball fpBGA (23 x 23 mm)	4/304	4/303	4/270
672-ball fpBGA (27 x 27 mm)		4/410	8/372
900-ball fpBGA (31 x 31 mm)			8/410	16/416	16/416
1152-ball fpBGA (35 x 35 mm)				16/436	16/520