Small Form Factor

The MachXO2 family of infinitely reconfigurable Programmable Logic Devices (PLDs) brings to market some of the smallest package footprints in the industry. With its Wafer Level Chip Scale Package (WLCSP), Ultra Chip scale Ball Grid Array (ucBGA) and Chip Scale Ball Grid Array (csBGA) package options for MachXO2, Lattice offers superior packaging solutions for markets demanding the smallest possible form factor. As consumer device connectivity and space constraints move in opposite directions, this class of devices opens up new possibilities for designers.

Small Form Factor Package Availability:

• 25-ball, 0.4mm pitch Wafer Level Chip Scale Package, 2.5mm x 2.5mm footprint
• 49-ball, 0.4mm pitch Wafer Level Chip Scale Package, 3.1mm x 3.0mm footprint
• 64-ball, 0.4mm pitch Ultra Chip Scale BGA, 4mm x 4mm footprint
• 132-ball, 0.5mm pitch Chip Scale BGA, 8mm x 8mm footprint

Single Chip Integration:

• Functional integration
  • Hardened I2C, SPI, and timer/counter functions save up to 600 LUTs
  • Up to 240 Kbits embedded block RAM and 256 Kbits user Flash memory
• Operate off single power supply
  • Integrated voltage regulator for HC devices 
• Space-saving single chip
  • On-chip Flash memory provides instant-on, high security and single chip solution 
  • No configuration device required

Download MachXO2 WLCSP News Brief

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