Designers of handheld, battery-based consumer products have long awaited a programmable logic solution that delivers design flexibility and fast time-to-market benefits coupled with features that address their power, logic capacity, cost, and small form factor requirements. This solution, previously unattainable by other FPGA suppliers, is now provided by Lattice's ultra-low power mobileFPGA™ devices.

Utilizing the mobileFPGA platform, mobile designers can quickly bring new features and custom functionality to market with their very own Custom Mobile Device. Designers can achieve this by either using state of the art development software or by utilizing Lattice's design services.
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LP-Series |
HX-Series |
| The LP-Series of the iCE40™ "Los Angeles" mobileFPGA™ family is ideal for smartphone applications. | The HX-Series of the iCE40™ "Los Angeles" mobileFPGA™ family is ideal for tablet applications. |
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Sensor Management ExampleOffload sensor management functions from Application Processor to Lattice Custom Mobile Device (CMD) to conserve system power (keep AP in low power, sleep mode).
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Video and Imaging ExampleDrive different video peripherals from the same Application Processor video stream.
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| LP Series (Low Power) | HX Series (High Performance) | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Features | LP640 | LP1K | LP4K | LP8K | LP16K | HX640 | HX1K | HX4K | HX8K | HX16K | |
| Logic Cells | 640 | 1,280 | 3,520 | 7680 | 16,192 | 640 | 1,280 | 3,520 | 7680 | 16,192 | |
| Embedded RAM Bits | 32K | 64K | 80K | 128K | 384K | 32K | 64K | 80K | 128K | 384K | |
| Phase-Locked Loops | 1 | 1 | 2 | 2 | 2 | 1 | 1 | 2 | 2 | 2 | |
| Typical Core Current @ 0 KHz 1 |
35 µA |
40 µA |
140 µA |
160 µA |
250 µA |
200 µA |
267 µ W |
267 µA |
1100 µA |
2500 µA |
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| Package2 | Footprint | User I/O ( Differential Pairs) | |||||||||
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CM 36 3
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2.5 x 2.5
mm |
25 (3) | 25 (3) | ||||||||
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CM 49
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3 x 3
mm |
35 (5) | 35 (5) | ||||||||
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CM 81
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4 x 4
mm |
63 (8) | 63 (8) | 63 (9)4 | |||||||
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CM 121
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5 x 5
mm |
95 (12) | 93 (13) | 93 (13) | |||||||
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CM 225
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7 x 7
mm |
167 (20) | 178 (23) | 178 (23) | 178 (23) | ||||||
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QN 843
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7 x 7
mm |
67 (7) | |||||||||
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CB 132
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8 x 8
mm |
95 (11) | 95 (12) | 95 (12) | |||||||
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CB 284
|
12 x 12
mm |
222 (25) | |||||||||
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CT 256
|
14 x 14
mm |
206 (26) | 206 (26) | ||||||||
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VQ 1003
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14 x 14
mm |
67 (8) | 72 (9) | ||||||||
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TQ 144
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20 x 20
mm |
96 (12) | 107 (14) | ||||||||
1 At 1.2v VCC
2 Packages: CB-0.5 mm pitch Chip-Scale Ball Grid Array, CM-0.4 mm pitch Chip-Scale Ball Grid Array, CT-0.8 mm pitch Ball Grid Array, TQ-Thin Quad Flat Pack, VQ-Very Thin Quad Flat Pack
3 No PLL Available
4 Only 1 PLL Available