Lattice Announces Broad Support for Lead-Free Products

- Supports FPGA, FPSC, CPLD, SPLD and Power Manager Families -
- Recognized as a member of the "Sony Green Partner Program" -

HILLSBORO, OR - FEBRUARY 2, 2004 - Lattice Semiconductor Corporation (NASDAQ: LSCC), the inventor of in-system programmable (ISP™) logic products, today announced the formal launch of its Pb-free (lead-free) product portfolio. Lattice has been supporting Pb-free components for select product families and select customers for well over a year. Now that the market demand for Pb-free components has developed on a global scale, Lattice is formally launching a broad portfolio of product families with Pb-free package options.

Lattice Semiconductor is one of the industry's largest suppliers of lead-free programmable logic devices and is a leader in the development of lead-free and "green" (halogen-free) packaging solutions. While Lattice now offers an extensive list of standard products in lead-free package options, current efforts will make halogen-free "green" package options available later in 2004.

Lead-Free Solutions
Lattice has qualified a wide variety of package types in lead-free configurations. These qualified packages includes the Thin Quad Flat Pack (TQFP), Fine Pitch BGA (fpBGA), Fine Pitch Super BGA (fpSBGA), Chip Scale BGA (csBGA) and Quad Flat-Pack (QFN). To better facilitate the industry transition to lead-free PLDs, Lattice offers the following broad assortment of standard, off-the-shelf, lead-free product families:

• ispXPGA� Non-Volatile, Reprogrammable FPGA Family (3.3V/2.5V/1.8V)
• ORCA� Field Programmable System Chips (FPSCs)
• ispMACH™ 4000 CPLD Family (3.3V/1.8V)
• ispMACH™ 4000Z CPLD Family (1.8V Zero Power)
• ispXPLD™ 5000MX Family (3.3V/1.8V)
• ispGAL�22V10AV (3.3V GAL)
• ispPAC�-POWER 1208/604 Power Manager Family

Backward Compatibility
All of Lattice's lead-free TQFP and QFN packages are "backward compatible" with conventional leaded manufacturing methodologies. This backward compatibility allows users to surface mount Lattice's lead-free packages onto lead-based PCBs and/or use Lattice lead-free packaging with leaded solders. "Users can now obtain a single, lead-free component from Lattice and use it in either a leaded or lead-free manufacturing environment without any issues. This capability greatly simplifies the inventory management challenges associated with the migration from conventional lead-based to lead-free manufacturing," said Steve Stark, Director, Lattice Product Marketing.

Reflow Profile
Lattice lead-free packages are currently qualified to a minimum of Level 3 moisture resistance with peak reflow temperatures of either 250C or 260C, dependent on the package configuration and consistent with the IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices.

Lead-free product information is available on the Lattice website (http://www.latticesemi.com), which includes updated datasheets with lead-free ordering part numbers, a Lead-Free/Green Packaging Product brochure, and a Reflow Profile for Lattice Lead-Free products (TN1076) as well as Lattice's environmental policy.

Lattice remains committed to continually reducing any adverse impact of its products on the world's natural environment, and works closely with its customers and suppliers to identify and rapidly eliminate hazardous substances from its products.

About Lattice Semiconductor
Lattice Semiconductor Corporation designs, develops and markets the broadest range of Field Programmable Gate Arrays (FPGAs), Field Programmable System Chips (FPSCs) and high-performance ISP™ programmable logic devices (PLDs). Lattice provides total solutions for today's system designs by delivering innovative programmable silicon products that embody leading-edge system expertise.

Lattice products are sold worldwide through an extensive network of independent sales representatives and distributors, primarily to OEM customers in the fields of communications, computing, computer peripherals, instrumentation, industrial controls and military systems. Company headquarters are located at 5555 NE Moore Court, Hillsboro, Oregon 97124 USA; Telephone 503-268-8000, FAX 503-268-8037. For more information about Lattice Semiconductor Corporation, visit http://www.latticesemi.com.

Statements in this news release looking forward in time are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Investors are cautioned that forward-looking statements involve risks and uncertainties including market acceptance and demand for our new products, our dependencies on our silicon wafer suppliers, the impact of competitive products and pricing, technological and product development risks and other risk factors detailed in the Company's Securities and Exchange Commission filings. Actual results may differ materially from forward-looking statements.

Lattice Semiconductor Corporation, L (& design), Lattice (& design), in-system programmable, ispMACH, E²CMOS, GAL, ISP, ORCA, ispGAL, ispPAC, ispXPGA, ispXPLD and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.

For more information contact:

Brian Kiernan, Corporate Communications Manager
Lattice Semiconductor Corporation
brian.kiernan@latticesemi.com
voice: (503) 268-8739
fax: (503) 268-8193