Lattice Expands Its Revolutionary ispXPLD Device Family with 1,024 and 256 Macrocell Members- ispXPLD 51024MX and ispXPLD 5256MX Now Production Released - HILLSBORO, OR - AUGUST 4, 2003 - Lattice Semiconductor Corporation (NASDAQ: LSCC), the inventor of in-system programmable (ISP™) logic products, today announced the release of two additional members of its revolutionary in-system programmable eXpanded PLD (ispXPLD) family, the ispXPLD 51024MX and ispXPLD 5256MX devices. The ispXPLD 51024MX features up to 1,024 logic macrocells and up to 512 kilobits of on-chip memory and represents the largest member of the family. The ispXPLD 5256MX provides up to 256 logic macrocells and up to 128 kilobits of on-chip memory and is the smallest member of the device family. The ispXPLD architecture is the first PLD architecture that allows users to efficiently trade off fast logic and block memory resources. The unique architecture offers Multi-Function Blocks (MFBs) that can be independently used for logic functions (up to 32 macrocells per MFB) or memory functions (up to 16 kilobits per MFB), yielding up to 1,024 logic macrocells or 512 kilobits of on-chip memory on a single device, equivalent to 300K system gates. The ispXPLD 51024MX device delivers 5.2ns pin-to-pin delay (tPD ), 3.8ns clock-to-output delay (tCO ), 3.0ns set- up time (tS) and 235MHz operating frequencies (fMAX). The ispXPLD 5256MX device provides 4.0ns tPD, 2.8ns tCO, 2.2ns tS, and 300MHz fMAX. The ispXPLD 5000MX family is available in 1.8, 2.5 and 3.3 Volt power supply versions, designated the ispMACH 5000MC, 5000MB and 5000MV series respectively. The devices are offered in 256, 512, 768 and 1,024 macrocell-equivalent densities with 141 to 381 user I/O, corresponding to 75K to 300K system gates. Programmable sysI/O™ interface capability provides flexible advanced I/O standard (GTL+, HSTL, SSTL, LVDS, etc.) support, as well as 5 volt tolerant I/O. Advanced non-volatile E2CMOS� silicon technology, combined with proprietary circuit design techniques, provides standby power consumption as low as 36 milliwatts per device for power-sensitive applications. Each device also incorporates Lattice's sysCLOCK™ phase-locked loops (PLL) capability for high-performance on-chip clock synthesis. The mix of system-level functionality, memory and logic allows the ispXPLD devices to address mainstream system functions previously served only by FPGAs or ASICs. Potential application areas include high-performance bus bridges, intelligent backplane interfaces and protocol processors. At 1,024 macrocells, the ispMACH 51024MX is the highest density product term-based logic architecture available in the industry, delivering wide decoding capability and predictability of timing. With this new 1,024 macrocell density point, system- level functions can now take advantage of the expanded logic density along with other ispMACH 5000MX device features: flexible on-chip memory, PLLs, sysI/O interface, and ispXP™ technology with instant-on capability that eliminates external PROM requirements. Multi-Function Block Implements Macrocells or Memory Efficiently ispXP Technology - Non-Volatile and Infinitely Reconfigurable Design Tools Price and Availability About Lattice Semiconductor Lattice products are sold worldwide through an extensive network of independent sales representatives and distributors, primarily to OEM customers in the fields of communication, computing, computer peripherals, instrumentation, industrial controls and militaty systems. Company headquarters are located at 5555 NE Moore Court, Hillsboro, Oregon 97124 USA; Telephone 503-268- 8000, FAX 503-268-8037. For more information on Lattice Semiconductor Corporation, access our World Wide Web site at http://www.latticesemi.com. Statements in this news release looking forward in time are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Investors are cautioned that forward-looking statements involve risks and uncertainties including market acceptance and demand for our new products, our dependencies on our silicon wafer suppliers, the impact of competitive products and pricing, technological and product development risks and other risk factors detailed in the Company�s Securities and Exchange Commission filings. Actual results may differ materially from forward-looking statements. # # #
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