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News Release

Lattice Semiconductor Introduces World's Most Flexible Analog Front End Device

-New ispPAC30 Device is Dynamically Reconfigurable -

HILLSBORO, Ore. - OCTOBER 29, 2001 - Lattice Semiconductor Corporation (NASDAQ: LSCC), the world's largest supplier of in-system programmable devices, today announced the latest member of its ispPAC programmable analog device family. The industry's first high performance in-system programmable and dynamically reconfigurable analog IC, the ispPAC30.

The ispPAC30 device integrates all the essential analog front-end functions for a typical data acquisition/conversion application. It brings superior flexibility through the new capability of dynamic in-system reconfiguration of gain, analog routing, precision voltage reference, output amplifier configuration, I/O, and other features, coupled with an enhanced architecture and increased bandwidth of operation - up to 1.5 MHz. With its superior performance capabilities, the ispPAC30 device is an ideal companion for a Single or Dual Analog-to-Digital converter.

"It's always been tough to design flexible systems around fixed function analog circuits," said Andy Robin, VP of New Venture Business for Lattice. "Now the dynamic in-system reconfiguration capability of the ispPAC30 opens new doors for engineers by enabling implementation of ultra-flexible analog circuits with high precision."

PAC30 Applications

The ispPAC30 device provides all typical signal-conditioning functions for a data acquisition application, such as programmable gain, offset, and filtering. The rail-to-rail output swing, along with very fine gain resolution (0.01x steps) and an offset adjustment capability makes this device suitable for multi-channel signal conditioning and many control applications. Power sensitive applications can also take advantage of the ispPAC30's 10 mA standby current.

ispPAC30 is Supported by PAC-Designer� Version 1.3 Software

ispPAC30 designs can be implemented using Lattice's popular PAC-Designer version 1.3 software. PAC-Designer software is an intuitive schematic design entry and simulation tool. A new capability introduced in this latest version (PAC-Designer v1.3) is manufacturing support library functions. These functions can be used to automatically calibrate the analog parameters of the circuit in the manufacturing line to compensate for other components' tolerances, resulting in higher performance and yield of the end product at much reduced time and cost.

PAC-Designer Version 1.3 (isppac.exe) is available for free download from www.latticesemi.com.

PAC-System Development Kits

The PACsystem30 is a low cost development tool designed to enable designers to build quick prototypes of their circuit implementation and to measure its performance. The design implemented using PAC-Designer is downloaded into the device through the ispDOWNLOAD cable that connects to the PC's parallel port.

The PACsystem30 is comprised of an evaluation board for the ispPAC30, an ispDOWNLOAD� cable, ispPAC Handbook, PAC-Designer v1.3 software, and two - ispPAC30-01PI samples.

Price and Availability

The ispPAC30 device in Industrial temperature grade (-40�C to +85�C) is priced under $7 per device in thousands. The ispPAC30 device is available in both 24-pin SOIC and 28-pin DIP packages. The ordering part numbers of the devices in these two packages are ispPAC30-01SI and ispPAC30-01PI , respectively.

PACsystem30 evaluation kits are also available through authorized Lattice Semiconductor distributors or on the Lattice Semiconductor web site at a suggested retail price of $149.

About Lattice Semiconductor

Oregon-based Lattice Semiconductor Corporation designs, develops and markets the broadest range of high-performance ISPTM programmable logic devices (PLDs) and offers total solutions for today's advanced logic designs.

Lattice products are sold worldwide through an extensive network of independent sales representatives and distributors, primarily to OEM customers in the communication, computing, instrumentation, industrial, and military end markets. Company headquarters are located at 5555 NE Moore Court, Hillsboro, Oregon 97124 USA; Telephone 503-268-8000, FAX 503-268-8037. For more information, access our World Wide Web site at http://www.latticesemi.com.

Statements in this news release looking forward in time are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Investors are cautioned that forward-looking statements involve risks and uncertainties, including technological and product development risks, market acceptance and demand for our new products, our dependencies on silicon wafer suppliers, the impact of competitive products and pricing, and other risk factors detailed in the Company's Securities and Exchange Commission filings. Actual results may differ materially from forward-looking statements.

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Lattice Semiconductor Corporation, L (& design), Lattice (& design), in-system programmable, ispDesignEXPERT, SuperFAST, ispLSI, E2CMOS, ISP and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.

For more information contact:

Andy Robin, VP, New Venture Business
Lattice Semiconductor Corporation
andy.robin@latticesemi.com
(408) 826-6222