Lattice Semiconductor Corporation
Home > About Us > Newsletters > LatticeNEWS November 2010 > Green Packaging

LatticeNEWS November 2010

Lattice Green PackagingLattice PLDs "Go Green" for Consumer Electronics

Environment-Friendly Material Options for the ispMACH 4000ZE CPLD Family Now Available.

Halogen- and lead-free packages for the ispMACH 4000ZE CPLD family, a popular programmable logic solution for high-volume consumer electronics, are now available. Bromine and chlorine, halogens associated with ozone depletion, have been replaced with more environmentally friendly materials. Lead and halogens have been eliminated from the ispMACH 4000ZE IC package materials to comply fully with industry standards such as Japan's JGPSSI and Europe's RoHS. For lead-frame based packages, the plating process has been modified to remove lead, and halogens have been removed from die-attach and mold compounds that encapsulate the IC.

Halogen elements are used in some IC substrate material, and in sufficient quantities they can be harmful to biological organisms. Lattice provides PLDs that allow designers to meet higher standards for electronic waste while still meeting their power and cost targets. The ispMACH 4000ZE is a proven green PLD for use in devices as diverse as portable GPS and mobile handsets, to digital set top boxes (STBs) and multi-function printers.

 

Green Packaging Diagram

Lead- and Halogen-Free Package Options

Lattice has qualified a wide variety of package types in lead-free configurations. These qualified packages include the Plastic Leaded Chip Carrier (PLCC), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Fine Pitch BGA (fpBGA), Fine Pitch Thin BGA (ftBGA), Chip Scale BGA (csBGA), Ultra Chip Scale BGA (ucBGA), Chip Array BGA (caBGA), Flip Chip BGA (fcBGA), and Quad Flat-pack Saw-singulated (QFNS). Lattice's lead-free packages offer the same high quality and reliability benefits as devices that contain lead. For more information on Lead-Free, RoHS Compliant Packaging Support from Lattice, visit the Lattice web site.

All TQFP package variations and the 64-Ball csBGA package of the ispMACH 4000ZE family are now available in halogen-free packaging and use pure tin (Sn 100%) for lead plating and tin/silver/copper solder balls.

 

Package Device Lead-Free Halogen-Free

48-Pin TQFP

4032ZE
4064ZE
64-Ball csBGA 4032ZE
4064ZE
64-Ball ucBGA 4064ZE √   
100-Pin TQFP 4064ZE
4128ZE √ 
4256ZE √ 
132-Ball ucBGA 4128ZE  
144-Pin TQFP 4128ZE
4256ZE √ 

 

Package Composition
TQFP Lead plating:
Sn 100% (pure matte tin)
csBGA, ucBGA Solder ball composition:
Sn 96.5% / Ag 3% / Cu 0.5%

 

Environmental Information from Lattice

Lattice publishes a variety of environmental information resources:

Availability

ispMACH 4000ZE CPLDs feature a broad range of densities, packages and speed grade options and are available for ordering via the Lattice online store and through authorized Lattice distributors.

To Learn More

For further information about the use of ispMACH 4000ZE CPLDs in consumer designs, view the ispMACH 4000ZE for Consumer Electronics Video, visit the Lattice web site or contact your local Lattice sales representative.

 

Legal | Privacy Policy | Press | Careers | Investor Relations | Contact Us | Site Map | | Follow us  Lattice Semiconductor on Facebook  Lattice Semiconductor on Twitter  Lattice Semiconductor on YouTube  © Lattice Semiconductor Corporation 2012