June 2009

New Automotive-Qualified Chip Scale BGA Packaging for the LA-LatticeXP2 FPGA Family

As a result of increasing demand for small but powerful automotive solutions, Lattice has released low-cost, automotive temperature-qualified packaging for the non-volatile LA-LatticeXP2 FPGA  family. Based on Lattice’s 90-nanometer hybrid flexiFLASH technology, the new csBGA (Chip Scale Ball Grid Array) packaging enables designers to squeeze processing power in the tightest of automotive system form-factors, including automotive camera modules, parking assistance systems, telematics systems and multimedia centers.

Measuring only 1.35 mm in height and 64 mm square, the new 132-ball csBGA packaging is the industry's smallest package footprint available for non-volatile FPGAs. It is available for both the XP2-5 and XP2-8 devices, which are the two smallest devices in the LA-LatticeXP2 family. The new packaging has been fully qualified and characterized to meet the AEC-Q100 requirements from the Automotive Electronics Council.

With on-board flash memory blocks, the LA-LatticeXP2 family eliminates the need for external program memory, providing a true single-chip solution. Combining this capability with on-board DSP blocks, design security protection and high-speed source synchronous interfaces such as DDR/DD2 and 7:1 LVDS, the LA-LatticeXP2 delivers powerful processing capability in a tiny footprint, a must-have requirement in many automotive applications.

Production quantities of the XP2-5 and XP2-8 devices in the 132-ball csBGA packaging are available immediately. Lattice can provide standard PPAP (Production Part Approval Process) documentation upon request.

To Learn More

For further information about the LA-LatticeXP2 FPGA family, visit the Lattice website, or contact your local Lattice sales representative.