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In response to increasing demand for small but powerful automotive solutions, Lattice has released low-cost, automotive temperature-qualified packaging for the non-volatile LA-LatticeXP2 FPGA family. The new 132-ball csBGA package enables designers to squeeze processing power in the tightest of automotive system form-factors. Full story...
Lattice has released an industrial temperature-certified version of the popular LatticeXP2 FPGA family. Available in low-cost, small footprint BGA or QFP packaging, the LatticeXP2 now offers an industrial temperature option, in addition to standard commercial and automotive temperature ranges. Full story...
Lattice has released an extensive portfolio of Digital Signal Processing IP cores to support the LatticeECP3 family. Full story...
Lattice's new Multi-Channel (MC) Digital Up/Down reference design can be used for scaling the sample rate of signals in various 4G applications such as LTE and WiMax. Full story...
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June 2009
© Lattice Semiconductor Corporation 2012
