February 2010On February 5 Lattice issued two PCNs to notify customers of our conversion and obsolescence of several packages for the LatticeSC and LatticeSCM device families.
We will convert the 1152-ball and 1704-ball Ceramic Flip-Chip Ball Grid Array (fcBGA) packages for these families, assembled at Fujitsu, to the Organic fcBGA assembled at Advanced Semiconductor Engineering (ASE). Additionally, we will discontinue the Ceramic fcBGA packages for the LatticeSC/M families. This affects the LatticeSC/M 40, 80, and 115 density devices. While the package height profile has changed there is no change to I/O and SERDES performance if users have applied our recommended SSO design practices as detailed in TN1114, Electrical Recommendations for Lattice SERDES. All other data sheet parameters remain the same.
We will also convert the 1020-ball Organic fcBGA package for the LatticeSC/M families, assembled at Fujitsu, to a new 1020-ball Organic fcBGA assembled at Advanced Semiconductor Engineering (ASE). A new package designator will be used because the lid for the new package utilizes different construction. Since we will be shipping both the old and the new packages for some period of time, we want to ensure users will not get a mixed shipment of the old and new packages. Finally, we plan to discontinue the current Organic fcBGA package for the LatticeSC/M families.
The PCNs provide package drawings, material sets, and qualification summaries. PCN delivery will be made through both our new web notification process and through personal delivery by your local field sales representative. Learn more about PCNs and how to sign up for automatic PCN delivery by visiting the Lattice web site .
© Lattice Semiconductor Corporation 2012
