February 2009

Q4 2008 Lattice Products Reliability Report

The Lattice Products Reliability Report Q4 2008 is now available. This report reflects our continued commitment to product quality and reliability. The information in this report is drawn from an extensive program of wafer technology and packaging assembly monitoring. This program, at Lattice and in partnership with our foundry and assembly suppliers, drives continuous improvement into all our quality systems. 

What's New This Quarter

Our goal is to continually improve the content of our Reliability Monitor Report. To that end, the following enhancements were made in this month's edition.

1. Updated reliability data for each process technology and package family can be found in the report. New data is in italics format for easy identification.
   
2. The format and look-and-feel of the report have been updated to reflect Lattice standard publishing metrics. This makes the report easier to read, and brings a new level of organization to the data.
   
3. The table of contents is now a true listing of content. Use the table of contents to search for the specific wafer process technology or package technology, then click the link. You will be taken directly to the specific data in the body of the report.

To Learn More 

For further information about product quality and reliability at Lattice, go to the Quality, Reliability and Environmental Information page of the Lattice website and select your topics of interest.