August 2010

Environment-Friendly Material Options Make ispMACH 4000ZE a Greener IC for Consumer Electronics

Lead exposure is a serious health risk that can lead to a variety of ailments. Gases containing halogens (bromine and chlorine) contribute to depletion of the ozone layer which prevents harmful ultraviolet light from passing through the Earth’s atmosphere. To minimize the health risks and environmental impact of electronic waste the semiconductor and IC packaging industries have innovated with new lead and halogen-free materials.

The ispMACH 4000ZE CPLD family, a popular programmable logic solution in high-volume consumer electronics, provides green packaging options that comply with recent industry regulatory requirements. Several components of the IC package material set are evaluated to eliminate lead and halogens. For lead-frame based packages the plating process is modifed to remove lead and halogen-free die-attach and mold compounds that encapsulate the IC. Any material change must continue to meet the reliability and quality standards of the IC assembler and manufacturer to ensure the device will have the same delamination resistance, moisture sensitivity, and vibration tolorances as devices using traditional materials.

Lattice has qualified a wide variety of package types in lead free configurations. These qualified packages include the Plastic Leaded Chip Carrier (PLCC), Plastic DIP (PDIP), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), Fine Pitch BGA (fpBGA), Fine Pitch Thin BGA (ftBGA), Fine Pitch Super BGA (fpSBGA), Chip Scale BGA (csBGA) and Quad Flat-pack (QFN). Lattice’s lead-free packages offer the same high quality and reliability benefits as devices containing lead. For more information on Lead Free, RoHS Compliant Packaging Support from Lattice, visit the Lattice web site.

All TQFP package variations of the ispMACH 4000ZE family are Halogen free and use pure tin (Sn 100%) for lead plating. A portion of the current BGA offering shown in the table below are also available in the Halogen-free format. Please contact your local Lattice sales representative for more information.

To Learn More

• Device Material Breakdowns for Lattice Packaging
• Japan Electronics and Information Technology Industries Association (JEITA)
• European Waste in Electrical and Electronic Equipment (WEEE)