iCE40 LP/HX/LM

Instant mobile innovation that won’t break the bank.

Silicon has never been more flexible – Add new features to your mobile design and maximize product differentiation in an instant using up to 7680 programmable logic cells.

Power for the people – Designed from the ground up for low power starting at 25 µW, these iCE40 devices maximize battery life and minimize power consumption for ultra-low power, always-on applications.

High functional density for the thinnest devices - Squeezing so much functionality in such a small BGA package was no easy task. Measuring just 1.40 mm X 1.48 mm x 0.45 mm, iCE40 LP/HX/LM devices can fit in the most space constrained modules.

Features

  • Available in three series with LUTs ranging from 384 to 7680: Low power (LP), low power with embedded IP (LM) and high performance (HX)
  • Integrated hard I2C and SPI cores that enable flexible device configuration through SPI
  • Match your preferred display to your application processor with interfaces such as RGB, 7:1 LVDS and MIPI DPI/DBI
  • Multi-source your image sensors by implementing flexible bridges supporting common interfaces such as HiSPi, subLVDS, LVDS and Parallel LVCMOS
  • Up to 128 Kbits sysMEM™ Embedded Block RAM
  • Industry’s broadest range of 0.35 mm - 0.40 mm pitch BGAs fit in space-constrained applications

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Family Table

iCE40 LP Device Selection Guide
Parameters LP Series (Low Power)
LP384 LP640 LP1K LP4K LP8K
Logic Cells 384 640 1280 3520 7680
NVCM Yes Yes Yes Yes Yes
Static Power 21 uA 100 uA 100 uA 250 uA 250 uA
Embedded RAM Bits 0 32 K 64 K 80 K 128 K
Phase-Locked Loops - - 1 2 2
24 mA Drive - 3 33 - -
0.35 mm Spacing Total I/Os + Dedicated I/Os 4,5
 
LP384 LP640 LP1K LP4K LP8K
16-ball WLCSP2 (1.40 x 1.48 mm) 10 + 01 10 + 01
0.40 mm Spacing Total I/Os + Dedicated I/Os 4,5
 
LP384 LP640 LP1K LP4K LP8K
36-ball ucBGA (2.5 x 2.5 mm) 27 + 2 27 + 21
49-ball ucBGA (3 x 3 mm) 39 + 2 37 + 21
81-ball ucBGA (4 x 4 mm) 65 + 2 65 + 22 65 + 22
121-ball ucBGA (5 x 5 mm) 97 + 2 95 + 2 95 + 2
225-ball ucBGA (7 x 7 mm) 180 + 2 180 + 2
0.50 mm Spacing Total I/Os + Dedicated I/Os 4,5
 
LP384 LP640 LP1K LP4K LP8K
32-pin QFN (5 x 5 mm) 23 + 2
84-pin QFNS2 (7 x 7 mm) 69 + 21
81-ball csBGA2 (5 x 5 mm) 64 + 21
121-ball csBGA (6 x 6 mm) 94 + 21


iCE40 LM Device Selection Guide
Parameters LM Series (Low Power, Embedded IP)
LM1K LM2K LM4K
Logic Cells 1100 2048 3520
NVCM No No No
Static Power 100 uA 100 uA 100 uA
Embedded RAM Bits 64K 80K 80K
Phase-Locked Loops 1 1 1
I2C Core 2 2 2
SPI Core 2 2 2
Low Power Strobe Generator 1 1 1
High Frequency Strobe Generator 1 1 1
24 mA Drive 3 3 3
0.35 mm Spacing Total I/Os + Dedicated I/Os 4,5
 
LM1K LM2K LM4K
25-ball WLCSP6 (1.71 x 1.71 mm) 20 + 2 20 + 2 20 + 2
0.40 mm Spacing Total I/Os + Dedicated I/Os 4,5
 
LM1K LM2K LM4K
36-ball ucBGA (2.5 x 2.5 mm) 30 + 2 30 + 2 30 + 2
49-ball ucBGA (3 x 3 mm) 39 + 2 39 + 2 39 + 2


iCE40 HX Device Selection Guide
Parameters HX Series (High Performance)
HX1K HX4K HX8K
Logic Cells 1280 3520 7680
NVCM Yes Yes Yes
Static Power 296 uA 1140 uA 1140 uA
Embedded RAM Bits 64 K 80 K 128 K
Phase-Locked Loops 1 2 2
0.40 mm Spacing Total I/Os + Dedicated I/Os 4,5
 
HX1K HX4K HX8K
225-ball ucBGA (7 x 7 mm) 180 + 2
0.50 mm Spacing Total I/Os + Dedicated I/Os 4,5
 
HX1K HX4K HX8K
132-ball csBGA (8 x 8 mm) 97 + 2 97 + 2 97 + 2
100-pin VQFP2 (14 x 14 mm) 74 + 21
144-pin TQFP (20 x 20 mm) 98 + 2 109 + 2
0.80 mm Spacing Total I/Os + Dedicated I/Os 4,5
 
HX1K HX4K HX8K
121-ball caBGA (9 x 9 mm) 95 + 2
256-ball caBGA (14 x 14 mm) 208 + 2

1 No PLL available on the 16 WLCSP, 36 ucBGA, 81 csBGA, 84 QFN and 100 VGFP packages
2 Only one PLL available on the 81 ucBGA package
3 24 mA constant current sink available on the 16 WLCSP package only
4 Total I/Os include Dedicated I/Os
5 Dedicated I/Os are defined to be pins that are dedicated and cannot be used by user logic after configuration
6 25-ball WLCSP package for iCE40 LM does not support PLL

Example Solutions

iCE40 LP/HX/LM FPGAs can be used in countless ways to add differentiation to mobile products.  Shown below are four of the most common iCE40 LP/HX/LM design categories along with specific application examples.

Enhance Application Processor Connectivity

  • Provide additional GPIOs to extend the processor's interface capabilities
  • Translate voltages to overcome limitations in the supported voltage standards
  • Increase performance by aggregating multiple slow serial buses onto high-speed links

Increase Battery Life by Offloading Timing Critical Functions

  • Accurately send and receive data with IR LEDs and photodiodes for remote communication
  • Communicate via slow UART and I2C interfaces while the microprocessor is asleep
  • Capture all user inputs by buffering sensor data and generating smart interrupts

Increase System Performance through Hardware Acceleration

  • Reduce processor workload by pre-processing sensor data to generate nine-axis output
  • Rotate, combine and scale image data with efficient FPGA-based implementations
  • Use logic-based multipliers to implement high-performance digital signal filtering

Design Resources

Intellectual Property & Reference Designs

Simplify your design efforts by using pre-tested, reusable functions

Application Notes

Learn how to get the most from our line-up of FPGAs / development boards

Software

Complete Design Flows, High Ease of Use

Development Kits & Boards

Our development boards & kits help streamline your design process

Programming Hardware

Take the strain out of in-system programming & in-circuit reconfiguration with our programming hardware

Documentation

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